Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition

Chen, Yuanming; He, Wei; Chen, Xianming; Wang, Chong; Tao, Zhihua; Wang, Shouxu; Zhou, Guoyun; Moshrefi-Torbati, M.

doi:10.1016/j.electacta.2013.12.112

Cited by 85 publications

(32 citation statements)

References 46 publications

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“…Electronic products with the demand of miniaturization, multifunction and portability pursue high density interconnection (HDI) of printed circuit boards (PCB) for transmitting electrical signals in high speed [1,2]. Copper electrodeposition has good agreement with HDI microvias metallization due to its void-free filling in the features, minimal topography of the final copper surface, and controllable impurity incorporation in the plated copper film [3][4][5].…”

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confidence: 95%

“…However, impure chemicals in phosphorized copper, released during electroplating process could influence the structure of copper deposits [7]. In addition, the change of size, topography and specific surface area of phosphorized copper during dissolved process could induce unstable current density and uneven distribution of electric fluxline, thereby resulting in weak plating uniformity of copper deposits [2,8]. Alternatively, a novel plating system with insoluble anode is employed for copper electrodeposition with high performance, where copper oxide is dissolved for the complement of cupric ions.…”

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confidence: 99%

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Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

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Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

et al. 2015

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“…Copper electrodeposition of multilayer printed circuit boards (PCB) from an acidic plating bath is a widely used method for meeting the demands of manufacturing electronic products . One particular challenge in this context is the defect‐free and uniform through hole (TH) electroplating of multilayer PCB . In order to obtain a well surface morphology and crystallization copper layer, a pack of organic additives is an adopted method for the metallization of TH with low cost and easy control .…”

Section: Introductionmentioning

confidence: 99%

Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Zhao

et al. 2019

ChemElectroChem

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A series of fatty acid quaternary ammonium surfactants (FAQAS 1 a–1 f) derived from renewable resource of fatty acid have been rationally designed and investigated as levelers applied in copper electroplating. Surface tension and contact angle indicated the FAQAS's surfactivity and wettability were closely related to the length of hydrophobic chains. FAQAS 1 a–1 f displayed the capability to inhibit the copper deposition in CV tests and their inhibiting abilities agreed with the order of their surfactivity and wettability. Compound 1 e showed the best inhibition capability, and was comprehensively tested by field‐emission scanning electron microscopy (FE‐SEM), X‐ray photoelectron spectroscopy (XPS) and other electrochemical measurements. The strong inhibition ability of compound 1 e on copper electrodeposition could be attributed to its fast and strong absorption of 1 e on the cathode surface. Moreover, galvanostatic measurements (GMs) indicated that compound 1 e not only cause polarization but also has stable synergistic effects with other additives to form a convection dependent competitive adsorption layer. In addition, through‐hole (TH) electroplating experiments verified that uniform TH could be obtained on copper electrodeposition using the bath containing compound 1 e. This work may shed some light on the pratical application of surfactants as effective leveler in acid copper electroplating.

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“…Printed circuit board (PCB) exhibits high density interconnection to realize high-speed signal transmission [1] . The reliability of PCB with gall grid array (BGA) soldering has become increasingly prominent since the popularity of all kinds of portable electronic products.…”

Section: Introductionmentioning

confidence: 99%

Dropping Simulation of Printed Circuit Board with BGA Soldering Assembly for Optical Module Application

Wang¹,

Chen²,

Li³

et al. 2016

Proceedings of 2016 International Conference on Modeling, Simulation and Optimization Technologies and Applications (MSOTA2016)

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Abstract-In this paper, finite element analysis was carried out to simulate the response of printed circuit board (PCB) assembly that fell and collided with a rigid surface using dropping simulation. The drop process was simulated by setting the drop parameters including falling directions and falling heights. The results revealed that 180°drop had the most severe damage for BGA solder joints. It also indicated that dynamic bending of the PCB resulted from the solder stress.

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Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition

Cited by 85 publications

References 46 publications

Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Dropping Simulation of Printed Circuit Board with BGA Soldering Assembly for Optical Module Application

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