Plating and Recrystallization of Galvanic Cu Films on Roll Annealed and Polycrystalline Cu Foils and the Effect of Intermediate Electroless Cu Layers

Bernhard, T.; Massey, Roger; Li, Zhiou; Schulze, Joerg-F.; Klaeden, K.; Zarwell, Sebastian; Steinhaeuser, E.; Bruening, Frank

doi:10.1109/ectc51906.2022.00227

Cited by 1 publication

(1 citation statement)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Facet selection is important for electroless and galvanic plating processes in the PCB industry. The orientation of surface facets of the electroless Cu layer has a major effect on the initial codeposition of galvanic Cu additives with implications to the final surface roughness of the stack 1,15,16 and subsequent recrystallization processes 17 …”

Section: Introductionmentioning

confidence: 99%

Facet type determination based on combined atomic force microscopy and electron backscatter diffraction

Brüning

Hajati

Lelièvre

et al. 2023

Journal of Microscopy

View full text Add to dashboard Cite

The distribution of facet types affects the functionality of the surfaces of polycrystalline films. However, we are not aware of a previously published convenient method to determine their distribution. This work describes and demonstrates a process to determine and map the Miller indexes (hkl) of crystal facets exposed at the surfaces of polycrystalline films. To find facet types in non‐trivial cases, one must know the orientation of the crystal and the direction in which the facet is facing. The method presented here combines the crystal orientations obtained with electron backscatter diffraction with the topography of the same sample area measured with atomic force microscopy. A challenging step is to transfer the data from the two instruments into a common coordinate system. The sequence of steps in the data processing is presented, with methods to verify the results. The process is illustrated with the analysis of an etched copper clad laminate (CCL) and an electroless Cu film deposited on the CCL. This example relates to facet selection in electroless and galvanic plating processes in printed circuit board production, where an uncontrolled transition from epitaxial to non‐epitaxial growth can lead to surfaces with unacceptable roughness.

show abstract

Section: Introductionmentioning

confidence: 99%