2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022
DOI: 10.1109/ectc51906.2022.00227
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Plating and Recrystallization of Galvanic Cu Films on Roll Annealed and Polycrystalline Cu Foils and the Effect of Intermediate Electroless Cu Layers

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“…Facet selection is important for electroless and galvanic plating processes in the PCB industry. The orientation of surface facets of the electroless Cu layer has a major effect on the initial codeposition of galvanic Cu additives with implications to the final surface roughness of the stack 1,15,16 and subsequent recrystallization processes 17 …”
Section: Introductionmentioning
confidence: 99%
“…Facet selection is important for electroless and galvanic plating processes in the PCB industry. The orientation of surface facets of the electroless Cu layer has a major effect on the initial codeposition of galvanic Cu additives with implications to the final surface roughness of the stack 1,15,16 and subsequent recrystallization processes 17 …”
Section: Introductionmentioning
confidence: 99%