Plating

Watanabe, Tohru

doi:10.1016/b978-0-12-821845-7.00002-3

Cited by 5 publications

(5 citation statements)

References 130 publications

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“…Boron comes from the reducing agent used during the deposition. It influences the microstructure of the deposit, with more boron leading to finer grains and eventually to amorphous material [40]. As boron is quite light element, specific conditions and instrument setup are needed for B detection in EDX [41].…”

Section: Characterization Of the Tubes C1 Chemical Analysismentioning

confidence: 99%

Flux-closure domains in high aspect ratio electroless-deposited CoNiB nanotubes

et al. 2018

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We report the imaging of magnetic domains in ferromagnetic CoNiB nanotubes with very long aspect ratio, fabricated by electroless plating. While axial magnetization is expected for long tubes made of soft magnetic materials, we evidence series of azimuthal domains. We tentatively explain these by the interplay of anisotropic strain and/or grain size, with magneto-elasticity and/or anisotropic interfacial magnetic anisotropy. This material could be interesting for dense data storage, as well as curvature-induced magnetic phenomena such as the nonreciprocity of spin-wave propagation.

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Section: Characterization Of the Tubes C1 Chemical Analysismentioning

confidence: 99%

Flux-closure domains in high aspect ratio electroless-deposited CoNiB nanotubes

et al. 2018

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“…) The electroless plating bath composition is shown in Table I. A similar more efficient electroless plating bath was described by Leeman et al 72 based on hydrazine as a reducing agent and several authors have reported on hydrazine based plating solution. 73,74 N H 2 4 reducing agent was used in the electroless plating which was conducted at 60 °C for 30 min.…”

Section: Methodsmentioning

confidence: 98%

Effects of Palladium Chloride Concentration on the Nanoscale Surface Morphology of Electroless Deposited Palladium Thin Film

Mpofu

Tapiwanashe

Tatenda

et al. 2021

J. Electrochem. Soc.

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Understanding the effects of thin film electroless deposition parameters at nanoscale is crucial for complete understanding and control of the thin film deposition process. In this study, we investigated and optimized the effect of PdCl 2 precursor concentration on the nanoscale surface morphology of electroless deposited Pd thin film. The FESEM characterization of plain substrates showed that the dominant features of plain alumina substrates were terraces, steps and bumpy microstructures and the final surface morphologies of the deposited Pd thin film was strongly dependant on the surface morphologies of the substrate. FESEM characterization results of seeding technique displayed a thin film of Pd nanoparticles on the surface of the alumina substrate. The number of times that the seeding process was carried out was optimized at five seeding times using hydrazine as a reducing agent. FESEM characterization revealed that the nanoscale surface morphology of the Pd thin film was strongly dependent on PdCl 2 precursor concentration. Three types of secondary nanoscale surface morphologies formed were nanorods, nanoflakes and flower-like Pd nanostructures at various concentrations. The nanoflake surface density was strongly dependent on PdCl 2 precursor concentration. Results of this research provided a foundation and method to tailor the nanoscale surface morphology to the specific requirement of surface dependent processes or reactions.

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“…In the X-ray diffraction analysis of the composite coatings, the main peak was detected at 2θ ≈ 43-43.34 • , which is attributed to the (102) lattice plane of the metastable NiSn phase. In addition, a small peak at 2θ ≈ 30 • is assigned to the (101) diffraction plane of the metastable SnNi phase [1,8,35]. The low-intensity peak at 2θ ≈ 80 • is attributed to tin.…”

Section: Surface Morphology and Structural Analysis Of Sn-ni/tio 2 Co...mentioning

confidence: 99%

Effects of Direct and Pulse Plating on the Co-Deposition of Sn–Ni/TiO2 Composite Coatings

Rosolymou,

Karantonis,

Pavlatou

2024

Materials

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Sn–Ni alloy matrix coatings co-deposited with TiO2 nanoparticles (Evonik P25) were produced utilizing direct (DC) and pulse electrodeposition (PC) from a tin–nickel chloride-fluoride electrolyte with a loading of TiO2 nanoparticles equal to 20 g/L. The structural and morphological characteristics of the resultant composite coatings were correlated with the compositional modifications that occurred within the alloy matrix and expressed via a) TiO2 co-deposition rate and b) composition of the matrix; this was due to the application of different current types (DC or PC electrodeposition), and different current density values. The results demonstrated that under DC electrodeposition, the current density exhibited a more significant impact on the composition of the alloy matrix than on the incorporation rate of the TiO2 nanoparticles. Additionally, PC electrodeposition favored the incorporation rate of TiO2 nanoparticles only when applying a low peak current density (Jp = 1 Adm−2). All of the composite coatings exhibited the characteristic cauliflower-like structure, and were characterized as nano-crystalline. The composites’ surface roughness demonstrated a significant influence from the TiO2 incorporation rate. However, in terms of microhardness, higher co-deposition rates of embedded TiO2 nanoparticles within the alloy matrix were associated with decreased microhardness values. The best wear performance was achieved for the composite produced utilizing DC electrodeposition at J = 1 Adm−2, which also demonstrated the best photocatalytic behavior under UV irradiation. The corrosion study of the composite coatings revealed that they exhibit passivation, even at elevated anodic potentials.

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Plating

Cited by 5 publications

References 130 publications

Flux-closure domains in high aspect ratio electroless-deposited CoNiB nanotubes

Flux-closure domains in high aspect ratio electroless-deposited CoNiB nanotubes

Effects of Palladium Chloride Concentration on the Nanoscale Surface Morphology of Electroless Deposited Palladium Thin Film

Effects of Direct and Pulse Plating on the Co-Deposition of Sn–Ni/TiO2 Composite Coatings

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