Plasticity enhancement of nano-Ag sintered joint based on metal foam

Liu, Yang; Zhao, Lixiang; Zhang, Hao; Xue, Yuxiong; Zhou, Min; Cao, Rongxing; Chen, Penghui; Zeng, Xianghua

doi:10.1007/s10854-021-05427-2

Cited by 3 publications

(3 citation statements)

References 22 publications

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“…The generation of numerous cracks is due to the alternating loads applied during power cycling [7], causing the sintered Ag layer to continuously endure tensile and compressive stresses at the interface. Additionally, unlike bulk Ag, sintered Ag exhibits poor ductility, which is also a concern for its application [8]. Therefore, under the continuous action of alternating loads, many cracks are generated.…”

Section: Resultsmentioning

confidence: 99%

Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling

Huo,

Wang,

Chen

et al. 2024

IMAPSource Proceedings

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With the increasing power and miniaturization of power electronics, the power cycling reliability and thermal management of power modules have become increasingly crucial. To address this issue, our Lab. has developed a novel instrument that allows simultaneous power cycling and real-time thermal resistance measurement. Utilizing this specific instrument, we investigated the microstructural evolution of the die attachment layer during power cycling and monitored the real-time thermal resistance of the SiC-TEG (Silicon Carbide-Thermal Engineering Group) heater chip/sintered Ag/DBA (Directed Bonded Aluminum with ceramic core of Si3N4) structure. Additionally, strategies to improve the degradation of the microstructure were proposed. The results indicate that after 10000 power cycles, numerous cracks were observed in the sintered Ag layer. However, the addition of 5 wt. % A1 suppressed the generation of cracks significantly. The addition of A1 particles has little effect on the transient thermal resistance during power cycling.

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Section: Resultsmentioning

confidence: 99%

Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling

Huo,

Wang,

Chen

et al. 2024

IMAPSource Proceedings

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“…The silver paste contains a variety of organic additives, including dispersants, which disperse silver particles to prevent agglomeration [12]. In the sintering process, the organic matter will be removed slowly.…”

Section: B Sintering Temperature Profilementioning

confidence: 99%

Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

Yan

et al. 2022

2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrateattach materials limit the high-temperature applications of packaging modules due to their high thermal resistance and high-temperature reliability. To solve the above deficiency, a copper foam-silver composite was proposed in this paper, which was prepared by mixing copper foam solid skeleton with micron silver paste. According to the results of thermogravimetric analysis (TGA) of silver paste, the preheating process was determined and sintered at 270℃ and 10MPa. The influence of different preparation technology on the quality of sintered joint was investigated. The morphology characteristics and distribution of sintered silver in the copper foam were observed by scanning electron microscope (SEM). The results show that the sintered silver of group C samples can be uniformly filled into the solid skeleton of copper foam, and the densification degree is high, without cracks, delamination, and holes. The shear strength can reach 55MPa.

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“…However, due to the coarse shape of solder bumps, it is difficult to fabricate finely spaced bumps, which could not satisfy the requirement of high-density packaging. Furthermore, the interfacial intermetallic compounds (IMCs) growing during service and inferior electrical migration resistance of solder joints will affect the reliability and lifetime of electronic facilities [20][21][22].…”

Section: Introductionmentioning

confidence: 99%

Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging

et al. 2022

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With the rapid development of nano/micro technology for commercial electronics, the typical interconnection method could not satisfy the high power-density packaging requirement. The 2.5D/3D integrated packaging was seen as a promising technology for nano/micro systems. The gold (Au) bump was the frequently used bonding method for these systems because of its excellent thermal, electric, and mechanical performance. However, relatively little work has been performed to analyze its height uniformity. In this study, the simulation and experimental methods were used to analyze the Au bump height uniformity. Firstly, the electroplating process of Au bump under different flow field parameters was simulated by COMSOL software. The simulated results indicated that the Au+ concentration polarization was the significant reason that caused the non-uniform distribution of Au bump along the wafer radius. Meanwhile, the flow field parameters, such as inlet diameter, inlet flow, titanium (Ti), wire mesh height, and Ti wire mesh density, were optimized, and their values were 20 mm, 20 L/min, 12 mm, and 50%, respectively. Subsequently, the Au bump height uniformity under different current densities was analyzed through an experimental method based on these flow field parameters. The experimental results showed that the increases of current density would decrease the Au bump height uniformity. When the current density was 0.2 A/dm2, the average height, range, and deviance values of Au bump were 9.04 μm, 1.33 μm, and 0.43 μm, respectively, which could reach the requirement of high density and precision for 2.5D/3D integrated packaging.

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Plasticity enhancement of nano-Ag sintered joint based on metal foam

Cited by 3 publications

References 22 publications

Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling

Microstructure Evolution and Online Thermal Resistance of Ag Sintered SiC/DBA Power Module During Power Cycling

Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

Height Uniformity Simulation and Experimental Study of Electroplating Gold Bump for 2.5D/3D Integrated Packaging

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