Plasmonic Copper: Ways and Means of Achieving, Directing, and Utilizing Surface Plasmons

Oxidative and Colloidal Kinetics of Size‐Controlled Copper Structures through Surface Plasmon‐Regulated Examinations for Broadband Absorbance

“…In the case of different oxides of Cu like Cu 2 O, CuO dampens the localized surface plasmon resonance (LSPR) [13] intensity of the metal core (Cu) with an associated increase in band gap and hole mobilities. The oxidation problem can be precluded by multiple means, as has been reviewed recently by our group [14,15] through the addition of ligand molecules, capping agents, or stabilizing agents viz., polyvinyl pyrrolidone (PVP), [16] cetyl trimethyl ammonium bromide (CTAB), [17] L-ascorbic acid (AA), [18] Sodium dodecyl sulphate (SDS), [19] and ligand molecules like ethylene diamine (EDA). [20] Usually, molecules which can play a dual role of reducing as well as capping are intuitively preferred due to advantages such as less intensive postprocessing to isolate the CuNPs.…”

Oxidative and colloidal kinetics of size controlled copper structures through surface plasmon regulated examinations for broadband absorbance

“…In the case of different oxides of Cu like Cu2O, CuO dampens the localized surface plasmon resonance (LSPR) [13] intensity of the metal core (Cu) with an associated increase in band gap and hole mobilities. The oxidation problem can be precluded by multiple means, as has been reviewed recently by our group [14,15] through the addition of ligand molecules, capping agents, or stabilizing agents viz., polyvinyl pyrrolidone (PVP) [16], cetyl trimethyl ammonium bromide (CTAB) [17], L-ascorbic acid (AA) [18], Sodium dodecyl sulphate (SDS) [19], and ligand molecules like ethylene diamine (EDA) [20]. Usually, molecules which can play a dual role of reducing as well as capping are intuitively preferred due to advantages such as less intensive post-processing to isolate the CuNPs.…”