Plasma Treatment on the Plastic Substrates for Liquid Phase Deposited SiO2 Films for Flexible Electronics Applications

Abstract

Liquid phase deposition (LPD) method to grow the silicon dioxide interlayer on the PES plastic substrates with the O 2 /Ar plasma pre-treatment is investigated. After which, the interlayer on the plastic substrates is grown and the films' quality on the substrates with or without the plasma pre-treatment is examined by using scanning electron microscopy, etching rate of the oxide layer by the diluted HF solution and surface leakage current measurement. The pentacene-based organic thin film transistors on the dielectric layers suitable for flexible electronics applications are demonstrated.