Plasma Treatment and Copper Metallization for Reliable Plated-Through-Holes in Microwave PCBs for Space Electronic Packaging

Rao, C Hanumanth; Kothuru, Avinash; Singh, Avinash Kumar; Varaprasad, B.K.S.V.L.; Goel, Sanket

doi:10.1109/tcpmt.2020.3029228

Cited by 12 publications

(4 citation statements)

References 13 publications

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“…To reduce the parasitic parameter, multiple dies are stacked. This module uses a PTFE ultrathin substrate as the high-frequency and high-speed substrate . The potting material is epoxy resin, and PI is the passivation layer of dies .…”

Section: Resultsmentioning

confidence: 99%

“…This module uses a PTFE ultrathin substrate as the high-frequency and high-speed substrate. 35 The potting material is epoxy resin, 26 and PI is the passivation layer of dies. 36 The multiterminal lead-out and the magnetic field cancelation circuit design can make the parasitic inductance of the module extremely low (several nH).…”

Section: Morphology and Composition Of Tailored Coatingsmentioning

confidence: 99%

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Superior Surface-Insulated Polymers with Low Leakage Current Enabled by Tailored Coatings Deposited with Colliding Plasma Jets

Zhang,

Yao,

et al. 2023

ACS Appl. Mater. Interfaces

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Insufficient surface insulation margin is the primary challenge for a 10 kV plus high-voltage semiconductor module. Surface charge accumulation and electric field distortion are the leading causes of surface insulation failure. Power modules restrict leakage loss, so only insulation dielectrics with low surface conductivity can be used. However, low conductivity, accumulated charge dissipation, and distorted electric field optimization have always been contradictory. A potential barrier increase and electron affinity decrease are both less coupled approaches with conductivity, which may have the potential for reducing surface charge accumulation. Here, surface charge accumulation inhibition and local electric field optimization were synchronously realized by tailored coating deposition with colliding plasma jets. This novelty approach leads to a finer interfacial modification of the triple junction and its nearby interfaces. The high-barrier and low-affinity coatings deposited by colliding plasma jets suppress charge injection (electrode–polymer interface) and promote charge dissipation (gas–polymer interface), respectively. At the same time, the small-area semiconductor deposited at the triple junction relieves the distortion of the electric field. In the end, while maintaining a low leakage current, the surface flashover voltages of polytetrafluoroethylene, polyimide, and epoxy packaging polymers are significantly increased by 69.7, 43.2, and 39.6%, respectively. Notably, the normalized leakage loss is less than 3/10,000 of the commercially available SiC module, which vastly differs from the surface insulation improvement strategy that blindly increases surface conductivity. This tailored coating modification strategy provides a new idea for dielectric research. It has reasonable practicability due to fast, cheap, and environmentally friendly colliding plasma jets.

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Section: Resultsmentioning

confidence: 99%

Section: Morphology and Composition Of Tailored Coatingsmentioning

confidence: 99%

Superior Surface-Insulated Polymers with Low Leakage Current Enabled by Tailored Coatings Deposited with Colliding Plasma Jets

Zhang,

Yao,

et al. 2023

ACS Appl. Mater. Interfaces

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“…The drilled PCB panel is degreased in an ultrasonic tank containing 1, 1, 2-trichloroethylene for three minutes to remove the dirt inside the hole. Low-pressure oxy-fluoride gaseous plasma etching process [17,18] is used for desmearing and etch-back. A vacuum sealed plasma chamber [Source: Advanced Plasma System Inc., USA] is employed for plasma treatment processed in three different stages at 40 kHz (Radio Frequency), with 2.5 kW power and initially evacuating the chamber down to 100 mT pressure.…”

Section: Plasma Desmear and Etch-back Processmentioning

confidence: 99%

Materials and manufacturing technology for high reliability rigid-flex multilayer PCB for space 3D-electronics packaging

Hanumanth Rao,

Singh,

Varaprasad

et al. 2024

Eng. Res. Express

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Rigid-flex Multilayer PCB Technology enables the elimination of several connectors and bulky harness for interconnecting functional electronic systems. This minimizes packaging complexity and reduces performance degradation at high frequencies with an added advantage of reduced weight and volume in high-reliability space electronic packages. Here, only thermo-mechanically stable adhesiveless all polyimide flexible laminate cores and no-flow glass-polyimide prepregs are employed. To overcome the manufacturing issues like registration, coverlay protrusion into the rigid portions, and residual copper deposition at the intersections of flexible and rigid portions; a novel manufacturing process technology is proposed here. The technology has been successfully devised after choosing the most appropriate flexible, rigid, and low-flow prepreg materials. Herein, for the realization of Rigid-flex Multilayer PCB Technology with 2-layers of flex and 8-layers of rigid to meet the functional requirements of the board is presented. The critical registration issues associated with the dissimilar rigid and flexible substrates are successfully addressed to achieve best-fit registration and obtain minimum annular rings of 50 µm in all the inner layers for high reliability. Experimental results manifest that incorporating rigid-flex multilayer PCB technology significantly reduces weight (>30%) and volume (~40%) to high-reliability space electronics 3D packaging for static and dynamic applications.

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“…Polyimide (PI) and fiberglass (FR-4) are widely used as substrates for electronic components, and the metallization of these materials is a well-developed industrial process. , However, the deposition of metal structures onto the surface of polytetrafluoroethylene (PTFE) presents a significant challenge to the scientific community due to its high chemical inertness and poor adhesion of metals to its surface. − Nonetheless, PTFE and related fluoropolymers hold great potential in specific microelectronics applications owing to their aforementioned inertness and exceptional dielectric properties, including an extremely low dielectric constant and dielectric loss. , These properties are particularly valuable in rare-event detection and underground low-background experiments, as they effectively preserve signal integrity . PTFE-based electronic substrates play a crucial role in lowering the detection limit of detectors and scintillation calorimeters for dark matter and neutrino double beta decay detection …”

Section: Introductionmentioning

confidence: 99%

Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents

Avilova,

Khairullina,

Levshakova

et al. 2024

ACS Appl. Electron. Mater.

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In this study, we explore the feasibility of a promising approach to fabricate conductive copper patterns with arbitrary topology on various dielectric substrates using direct laser metallization from deep eutectic solvents. We demonstrate the capability to print on industrially relevant dielectric materials, including polyimide, fiberglass plastic, and polytetrafluoroethylene (PTFE) substrates. We investigate the geometric and electrical characteristics of the resulting patterns and their composition. Our findings highlight the significant influence of the substrate material on both the formation rate of structures and their final properties. The characteristic resistance of the fabricated copper patterns is in the range from 0.23 to 1.64 Ω × mm2/m. The rate of pattern formation varied from 0.5 to 3.5 mm/s, depending on the substrate used.

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Plasma Treatment and Copper Metallization for Reliable Plated-Through-Holes in Microwave PCBs for Space Electronic Packaging

Cited by 12 publications

References 13 publications

Superior Surface-Insulated Polymers with Low Leakage Current Enabled by Tailored Coatings Deposited with Colliding Plasma Jets

Superior Surface-Insulated Polymers with Low Leakage Current Enabled by Tailored Coatings Deposited with Colliding Plasma Jets

Materials and manufacturing technology for high reliability rigid-flex multilayer PCB for space 3D-electronics packaging

Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents

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