Plasma polymerization of organosilicon compounds

Abstract

SynopsisPlasma polymerizations in five silicon compounds having chemical formula of (CH3),Si-X--Si(CH,),, X = none, CH2, NH, 0, and S atoms, were investigated by elemental analysis, infrared spectroscopy, and ESCA. The chemical composition of polymers plasma-polymerized was influenced by the X groups in (CH,),Si--X--Si(CH,),.Polymers, when X was S atoms, possessed no sulfur; and X was CH2 groups polymers rich in carbon and hydrogen atoms were formed. Details in chemical composition were discussed by IR and ESCA. Such differences in chemical composition reflected on gas permeability of the plasma films.

Polymer Films with Embedded Metal Nanoparticles

“…For the main part, IR spectroscopy investigations carried out by other authors [63,68,[116][117][118][119][120][121][122] on film plasma polymerized from HMDSO have produced results similar to Fig. 2.2a.…”

“…Due to their large variety of chemical and physical properties, these films have been proposed for very different applications. Otherwise, because of the strong dependence on the deposition properties of films made from these and other monomers, it has been reported that they can also be used as gas separation layers or gas permeation layers [43,[62][63][64][65][66][67][68][69][70][71][72]. Organosilicon monomers like hexamethyldisilazane (HMDSN), hexamethyldisiloxane (HMDSO), vinyltrimethylsilane (VTMS), tetramethylsilane (TMS) or various other silanes, but also ethanes and ethenes as well as fluorocarbons like perfluorobenzene were the main components used.…”

Investigation of Gas Phase Species and Deposition of SiO2 Films from HMDSO/O2 Plasmas

“…Plasma‐enhanced chemical vapor deposition (PECVD) using organosilanes as starting materials is a promising method for depositing both inorganic SiO 2 ‐like films and polymer‐like SiO x C y H z films, depending on the plasma composition. SiO 2 and related SiO x C y H z films have found many applications in electronics,1 optics,2 barrier films for food packaging,3 and corrosion protection layers 4. The most utilized organosilicon precursors for the deposition of SiO 2 and related SiO x C y H z films are tetraethoxysilane (TEOS) and hexamethyldisiloxane (HMDSO), either 100% precursor or mixed with oxygen or nitrous oxide.…”

A Glucose Sensor with a Plasma-Polymerized Thin Film Fabricated by Dry Processes

“…Figure 1 shows the fabrication of the device. A plasma-polymerized ®lm (12 nm) of hexamethyldisiloxane (b) [19,20] was deposited on a cleaned glass slide (a). This was subsequently treated with ethylenediamine plasma to introduce amino groups onto the surface of the ®lm (c) [10].…”