Plasma-Induced Decomposition of Copper Complex Ink for the Formation of Highly Conductive Copper Tracks on Heat-Sensitive Substrates

Farraj, Yousef; Smooha, Ariel; Kamyshny, Alexander; Magdassi, Shlomo

doi:10.1021/acsami.6b14462

Cited by 73 publications

(77 citation statements)

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…More recently, a Cu MOD ink was printed on 2D and 3D substrates using inkjet and screen‐printing techniques, and plasma converted in a low‐pressure system using Ar or N 2 as the carrier gas as shown in Figure 8a, yielding Cu with conductivity as high as 23% of the bulk. [ 25 ] Another study significantly improved the conductivity of printed and plasma‐sintered Cu MOD ink to 55% of the bulk conductivity by using a low‐pressure RF‐powered H 2 plasma. [ 22 ]…”

Section: Schemesmentioning

confidence: 99%

“…Particle‐free inks. (a) Photos of Cu‐based metal‐organic decomposition ink printed and treated by low‐pressure plasma on a PEN substrate (left) and a three‐dimensional (3D) object fabricated by Objet303D printer (Veroblue, T g = 60°C; right), reprinted with permission from Farraj et al [ 25 ] (b) X‐ray powder diffraction spectra of printed metal salt inks with diffraction peaks indexed to the JCPDS database for the respective metals, as well as CuSO 4 and PbCl 2 precursors, reprinted with permission from Sui et al [ 26 ] …”

Section: Schemesmentioning

confidence: 99%

See 1 more Smart Citation

Plasmas for additive manufacturing

Sui

Zorman

Sankaran

2020

Plasma Processes & Polymers

View full text Add to dashboard Cite

Additive methods for manufacturing materials have recently emerged, particularly for the fabrication of three-dimensional architectures. Because of their long history in thin-film etching and deposition, plasmas offer unique advantages for many of the materials and surface processes associated with additive manufacturing. Here, we review recent efforts that have been primarily focused on the direct writing of patterned structures and the post-treatment of printed materials. Different configurations, materials, and applications are presented. Current challenges and a future outlook are also provided. 3D printing, additive manufacturing, microdischarges, nanotechnology, roll-to-roll

show abstract

Section: Schemesmentioning

confidence: 99%

Section: Schemesmentioning

confidence: 99%

Plasmas for additive manufacturing

Sui

Zorman

Sankaran

2020

Plasma Processes & Polymers

View full text Add to dashboard Cite

show abstract

“…Recent literatures focused on the researches of inorganic filler/polymer composites. Silver, copper or copper‐silver core‐shell particles were chosen as electron‐transfer carriers to enhance electrical conductivity of polymeric matrix . The composites with high thermal conductivity could be prepared with the addition of BN, SiC, or AlN as good thermal conductive networks into polymer matrix .…”

Section: Introductionmentioning

confidence: 99%

Electric and thermal performance of poly(phenylene oxide)‐based composites with synergetic modification of carbon nanotubes and nanoplatelets

Chen

Zhu

et al. 2018

Polymer Composites

View full text Add to dashboard Cite

The combination of carbon nanotubes (CNT)‐graphene (GE) or CNT‐graphite (GP) was chosen as inorganic fillers to form synergetic modification of poly(phenylene oxide) (PPO). Microstructure, electrical conductivity, dielectric permittivity and heat dissipation were characterized to investigate the performance difference of the composites containing CNT‐GE and CNT‐GP. The results indicated that PPO‐based composites with CNT‐GE could exhibit better electric and thermal performance than those with CNT‐GP when the adding filler was at same content. PPO‐based composite with 1.0 wt% GE and 7.5 wt% CNT exhibited glass transition temperature of 148.2°C, electrical conductivity of 3.7 × 10−6 S·cm−1 at 1 kHz, dielectric permittivity of 283 at 1 kHz and thermal conductivity of 0.73 W·m−1·K−1. POLYM. COMPOS., 39:E1920–E1927, 2018. © 2018 Society of Plastics Engineers

show abstract

“…Here, we report on copper complex inkjet ink that, following low‐temperature plasma treatment, enables the formation of high‐resolution (HR)‐patterned seed layers for electroless processes. The plasma treatment causes conversion of the complex into metallic copper.…”

mentioning

confidence: 99%

Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers

Farraj

Layani

Yaverboim³

et al. 2018

Adv Materials Inter

Self Cite

View full text Add to dashboard Cite

COMMUNICATION (1 of 7)in general, Internet of things (IoT) applications. [5] One approach to obtaining electronics on 3D surfaces is based on printing electrical circuits on flat surface, followed by reshaping them into 3D structures. [3b] A well-known example of such process is the thermoforming of thermoplastics with embedded circuits. [6] The drawback of this method is that it is limited in its possible patterns due to the dimensional changes that take place during the thermoforming stretching process, and the limitation to thin plastic films. Another method is by direct printing of conductive inks onto the 3D surfaces, with conductive inks composed of metal NPs. [1b,5,7] However, after printing, the NPs require a sintering process to decompose the organic stabilizers and to render it electrically conductive. Typical sintering processes are based on thermal treatment at elevated temperatures, which can damage some of the polymers that are currently used in typical 3D printers (T g < 80 °C). [8] The prerequisite for low sintering temperature results in low conductivity and poor surface smoothness. For low-frequency antenna applications, the result might be satisfying. However, for highfrequency applications, high conductivity and smooth surfaces are required. Accordingly, there is still an unmet need for a new scientific approach that would result in high conductivity, high surface smoothness, as well as perform at low temperature and low cost. A suitable approach to address these obstacles is the electroless copper plating (EP), which is commonly used to form highly conductive metallic structures. A typical EP process is composed of two main steps: first, a catalyst seed is deposited onto the designated substrate, followed by immersing into a metal salt solution with a reducing agent, resulting in metal coating of the pattern composed of the catalyst. Commonly reported seeds for 2D substrate are based on palladium (Pd), silver, and poly(dopamine). However, each of these materials has its limitations. For example, Pd [9] and silver, [3a,10] which are extensively reported, are very costly materials. With seeds based on poly(dopamine), [11] the obtained bulk resistivity is six times higher than that of bulk copper, which is not sufficient for EP processes. Copper-based seeds were also reported for 2D substrate by either sequential printing of copper salt and strong reducing agents [12] or by laser-induced forward transfer (LIFT) technique. The latter resulted in poor resolution and low 3D printed electronics is an emerging field of high importance in both academic research and industrial manufacturing. It enables fabrication of 3D devices with embedded or conformal electronic circuits, which are relevant to a variety of applications, such as Internet of things, soft robotics, and medical devices. Patterning of electrical conductors with conductivity higher than 50% bulk copper is challenging and usually involves electroless or electrolytic deposition processes that require the use of very costly catalyst, ma...

show abstract

Plasma-Induced Decomposition of Copper Complex Ink for the Formation of Highly Conductive Copper Tracks on Heat-Sensitive Substrates

Cited by 73 publications

References 29 publications

Plasmas for additive manufacturing

Plasmas for additive manufacturing

Electric and thermal performance of poly(phenylene oxide)‐based composites with synergetic modification of carbon nanotubes and nanoplatelets

Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers

Contact Info

Product

Resources

About