Plasma induced copolymerization of hexafluoropropylene and octafluoropropane

Leezenberg, Pieter B.; Reiley, T.C.; Tyndall, George W.

doi:10.1116/1.581581

Cited by 24 publications

(20 citation statements)

References 15 publications

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“…The effects of source gas, P for cw plasmas, d.c. for pulsed plasmas, and the distance of the substrate from the plasma glow were examined. 21 In contrast, the spectra of materials deposited in the coil from pulsed plasmas contain features consistent with amorphous cross-linked FC films, specifically the broad CF x (x ϭ1 -3) stretching modes between 1100 and 1400 cm Ϫ1 . FC films are produced in both cw and pulsed plasmas at all three positions, with the exception of the 15 W cw system at position A.…”

Section: A Ftir Spectroscopymentioning

confidence: 99%

Comparison of pulsed and downstream deposition of fluorocarbon materials from C3F8 and c-C4F8 plasmas

Martin

Malkov

Butoi

et al. 2004

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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Studies of fluorocarbon film deposition and its correlation with etched trench sidewall angle by employing a gap structure using C 4 F 8 ∕ Ar and C F 4 ∕ H 2 based capacitively coupled plasmas Comparison of plasma chemistries and structure-property relationships of fluorocarbon films deposited from octafluorocyclobutane and pentafluoroethane monomers Materials deposited in continuous wave ͑cw͒ and pulsed low-pressure octafluoropropane (C 3 F 8 ) and octafluorocyclobutane (c-C 4 F 8 ) plasmas were characterized using Fourier transform infrared spectroscopy ͑FTIR͒, x-ray photoelectron spectroscopy, static contact angle measurements, spectroscopic ellipsometry, and scanning electron microscopy ͑SEM͒. Fluorocarbon ͑FC͒ materials deposited in pulsed plasmas were less crosslinked than those deposited in cw plasmas with equivalent input powers. Within each system, higher F/C ratio materials were deposited by lowering the plasma input power/duty cycle. Using downstream depositions had a similar effect on film composition, but also resulted in decreased deposition rates. SEM analysis showed that decreases in the flexibility of the fluorocarbon films were correlated with increases in the percent of crosslinking. Additionally, the smoothness of the film surfaces suggests that polymerization processes occur on the substrate surface. Overall, films deposited in C 4 F 8 plasmas were more crosslinked and less flexible than those deposited in C 3 F 8 plasmas under the same conditions. The composition of the deposited FC films is correlated to the nature and relative concentrations of nascent ions previously measured in these plasma systems using plasma ion mass spectrometry.

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Section: A Ftir Spectroscopymentioning

confidence: 99%

Comparison of pulsed and downstream deposition of fluorocarbon materials from C3F8 and c-C4F8 plasmas

Martin

Malkov

Butoi

et al. 2004

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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“…PECVD fluorocarbon films17, 26, 71–75 often contain a variety of bonding environments such as CF 3 , CF 2 , CF, and quaternary carbon (Fig. 3a, top).…”

Section: Characteristics Of Cvd Polymersmentioning

confidence: 99%

Chemical Vapor Deposition of Conformal, Functional, and Responsive Polymer Films

et al. 2010

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Chemical vapor deposition (CVD) polymerization utilizes the delivery of vapor-phase monomers to form chemically well-defined polymeric films directly on the surface of a substrate. CVD polymers are desirable as conformal surface modification layers exhibiting strong retention of organic functional groups, and, in some cases, are responsive to external stimuli. Traditional wet-chemical chain- and step-growth mechanisms guide the development of new heterogeneous CVD polymerization techniques. Commonality with inorganic CVD methods facilitates the fabrication of hybrid devices. CVD polymers bridge microfabrication technology with chemical, biological, and nanoparticle systems and assembly. Robust interfaces can be achieved through covalent grafting enabling high-resolution (60 nm) patterning, even on flexible substrates. Utilizing only low-energy input to drive selective chemistry, modest vacuum, and room-temperature substrates, CVD polymerization is compatible with thermally sensitive substrates, such as paper, textiles, and plastics. CVD methods are particularly valuable for insoluble and infusible films, including fluoropolymers, electrically conductive polymers, and controllably crosslinked networks and for the potential to reduce environmental, health, and safety impacts associated with solvents. Quantitative models aid the development of large-area and roll-to-roll CVD polymer reactors. Relevant background, fundamental principles, and selected applications are reviewed.

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“…Polymer films grow most readily from plasma feedgases with F͞C ratio less than ϳ2.5 (6,10). Thus, C 3 F 6 feedgases more readily grow polymer films than CF 4 , C 2 F 6 , or C 3 F 8 (19,58). This effect is attributable in part to the higher intensities of C 3 F 5 ϩ and other large, unsaturated polyatomic ions in the C 3 F 6 plasma.…”

Section: Figmentioning

confidence: 99%

“…Polyatomic ions and neutrals larger than a triatomic play a critical role in plasma-induced surface chemistry, especially in the deposition of polymeric films from fluorocarbon plasmas (12,13,19,20). However, larger polyatomics are difficult to distinguish or even detect by plasma imaging methods, and their surface chemistry is poorly understood (21).…”

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confidence: 99%

Effects of unique ion chemistry on thin-film growth by plasma–surface interactions

Wijesundara

Hanley

et al. 2000

Proc. Natl. Acad. Sci. U.S.A.

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Plasma processing is a standard industrial method for the modification of material surfaces and the deposition of thin films. Polyatomic ions and neutrals larger than a triatomic play a critical role in plasma-induced surface chemistry, especially in the deposition of polymeric films from fluorocarbon plasmas. In this paper, low energy CF3+ and C3F5+ ions are used to modify a polystyrene surface. Experimental and computational studies are combined to quantify the effect of the unique chemistry and structure of the incident ions on the result of ion-polymer collisions. C3F5+ ions are more effective at growing films than CF3+, both at similar energy/atom of approximately 6 eV/atom and similar total kinetic energies of 25 and 50 eV. The composition of the films grown experimentally also varies with both the structure and kinetic energy of the incident ion. Both C3F5+ and CF3+ should be thought of as covalently bound polyatomic precursors or fragments that can react and become incorporated within the polystyrene surface, rather than merely donating F atoms. The size and structure of the ions affect polymer film formation via differing chemical structure, reactivity, sticking probabilities, and energy transfer to the surface. The different reactivity of these two ions with the polymer surface supports the argument that larger species contribute to the deposition of polymeric films from fluorocarbon plasmas. These results indicate that complete understanding and accurate computer modeling of plasma-surface modification requires accurate measurement of the identities, number densities, and kinetic energies of higher mass ions and energetic neutrals.

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Plasma induced copolymerization of hexafluoropropylene and octafluoropropane

Cited by 24 publications

References 15 publications

Comparison of pulsed and downstream deposition of fluorocarbon materials from C3F8 and c-C4F8 plasmas

Comparison of pulsed and downstream deposition of fluorocarbon materials from C3F8 and c-C4F8 plasmas

Chemical Vapor Deposition of Conformal, Functional, and Responsive Polymer Films

Effects of unique ion chemistry on thin-film growth by plasma–surface interactions

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