2012
DOI: 10.1016/j.tsf.2012.06.048
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Plasma diagnostics of an Ar/NH3 direct-current reactive magnetron sputtering discharge for SiNx deposition

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Cited by 21 publications
(19 citation statements)
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“…The compound sputtering mode should then to be avoided. Since this also affects the emission intensities of excited species from the plasma [4], we characterize the hybrid process used for CIGS solar cell deposition, by following characteristics emission lines of different species present in the plasma. We distinguished at least one line per element and selected the most intense and isolated ones.…”
Section: Plasma Analyses By Optical Emission Spectroscopymentioning
confidence: 99%
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“…The compound sputtering mode should then to be avoided. Since this also affects the emission intensities of excited species from the plasma [4], we characterize the hybrid process used for CIGS solar cell deposition, by following characteristics emission lines of different species present in the plasma. We distinguished at least one line per element and selected the most intense and isolated ones.…”
Section: Plasma Analyses By Optical Emission Spectroscopymentioning
confidence: 99%
“…Nevertheless, for reactive and hybrid CIGS deposition process, an appropriate control of the selenium flux is very important to prevent target poisoning. The poisoning reduces the deposition rate drastically and may also cause arcing which can result in defects in the deposited absorbers [4]. Typically, the variation of the target selfbias voltage provides information about the evolution of the target state under different sputtering conditions.…”
Section: Introductionmentioning
confidence: 99%
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“…This phenomenon results from the competition between the target sputtering and the formation of a stoichiometric compound on its surface by implantation and/or chemisorption of reactive species. The target poisoning reduces the deposition rate drastically which can result in defects in the deposited absorbers . In earlier work, we showed that optical emission spectroscopy is a reliable tool for studying the sputtering atmosphere, and to monitor the chemical species present in the plasma processes used for film deposition …”
Section: Introductionmentioning
confidence: 99%
“…The formation of a compound at target surface, called target poisoning, can modify the electrical characteristics of the discharge, which commonly lead to drop of deposition rate and loss of film 978-1-4799-4398-2/14/$31.00 ©2014 IEEE composition control. The compound sputtering mode should then be avoided, since this also affects the emission intensities of excited species from the plasma [4].…”
Section: Introductionmentioning
confidence: 99%