Epitaxial thin ferroelectric films of Pb(Zr 0.53 Ti 0.47 ) (PZT) were successfully grown on Sr(Nb)TiO 3 (SNTO) single crystal substrates by high-pressure rf sputtering. Pure O 2 was used as working gas at a pressure above 1 Torr. Deposition temperature was varied from 550°C to 600°C. Under these conditions we were able to deposit films at a rate of 2.7 Å/min. Their crystalline properties, evaluated by θ/2θ, ω and φ scans, showed both in-plane and out of plane orientation. Film composition and film-substrate interface characteristics were studied by Rutherford Backscattering Spectroscopy (RBS). For RBS data the composition ratios for the films were calculated having obtained the expected values for a stoichiometric composition. A very thin diffusion layer of Pb at the film-substrate interface was also introduced. However, the deficiency in Pb, which is correlated to the presence of oxygen vacancies, is lower in our films produced at high O 2 pressure than those reported for films produced by sputtering at lower pressures. The ferroelectric hysteresis loops measured in the Pt/PZT/SNTO heterostructures show good ferroelectric behavior with remanent polarizations of 12µCcm -2 and coercive field of 50kVcm -1 at 5V. The high-pressured technique representing a useful and capable method capable of obtaining in situ epitaxial, fully oxygenated, pyrochlore-free ferroelectric thin film with high quality structural, compositional and dielectric properties, without post deposit treatment.