Plasma boriding of a cobalt–chromium alloy as an interlayer for nanostructured diamond growth

Johnston, Jamin M.; Jubinsky, Matthew; Catledge, Shane A.

doi:10.1016/j.apsusc.2014.11.129

Cited by 29 publications

(11 citation statements)

References 33 publications

(43 reference statements)

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“…Boriding is a thermochemical treatment that increases the wear and corrosion resistance of ferrous and non-ferrous alloys by forming hard boride layers at the surface of the material [1]. In recent years, research on the boriding of cobalt alloys has advanced, specifically regarding the wear and oxidation properties of the cobalt boride layers [2][3][4]. In addition, the growth kinetics, some indentation properties, micro-abrasive wear resistance of CoB-Co 2 B, and the practical adhesion resistance of the cobalt boride layers formed on the surface of the CoCrMo alloy by means of the conventional powder-pack boriding (CPBP) process have been estimated [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Growth Kinetics of CoB–Co₂B Layers Using the Powder-Pack Boriding Process Assisted by a Direct Current Field

Campos-Silva

Franco-Raudales

Meda-Campaña

et al. 2018

High Temperature Materials and Processes

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New results about the growth kinetics of CoB–Co2B layers developed at the surface of CoCrMo alloy using the powder-pack boriding process assisted by a direct current field (PBDCF) were estimated in this work. The PBDCF was conducted at temperatures of 1048 – 1148 K with different exposure times for each temperature, whereas the growth kinetics of the cobalt boride layers was modelled using a system of two differential equations. In addition, indentation properties such as hardness, Young’s modulus and residual stresses were estimated along the depth of the borided CoCrMo surface. The growth kinetics of the cobalt boride layers developed by PBDCF indicated that thicker boride layers were formed on the material’s surface which was in contact to the current field at the anode, in contrast to the surface exposed at the cathode. The kinetics of cobalt boride layers were compared with those obtained by conventional powder-pack boriding process.

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Section: Introductionmentioning

confidence: 99%

Growth Kinetics of CoB–Co₂B Layers Using the Powder-Pack Boriding Process Assisted by a Direct Current Field

Campos-Silva

Franco-Raudales

Meda-Campaña

et al. 2018

High Temperature Materials and Processes

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“…Recently, we have shown that microwave PECVD is an effective method for thermochemical surface modification using diborane (B 2 H 6 ) in the feedgas to form metal-boride surface layers on cobalt-chromium alloys [18]. These borides often include orthorhombic CoB and bodycentered tetragonal Co 2 B structures, among others.…”

Section: Introductionmentioning

confidence: 99%

Metal-boride phase formation on tungsten carbide (WC-Co) during microwave plasma chemical vapor deposition

Johnston

Catledge

2016

Applied Surface Science

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Strengthening of cemented tungsten carbide by boriding is used to improve the wear resistance and lifetime of carbide tools; however, many conventional boriding techniques render the bulk carbide too brittle for extreme conditions, such as hard rock drilling. This research explored the variation in metal-boride phase formation during the microwave plasma enhanced chemical vapor deposition process at surface temperatures from 700 to 1100 °C. We showed several welladhered metal-boride surface layers consisting of WCoB, CoB and/or W 2 CoB 2 with average hardness from 23-27 GPa and average elastic modulus of 600-730 GPa. The metal-boride interlayer was shown to be an effective diffusion barrier against elemental cobalt; migration of elemental cobalt to the surface of the interlayer was significantly reduced. A combination of glancing angle x-ray diffraction, electron dispersive spectroscopy, nanoindentation and scratch testing was used to evaluate the surface composition and material properties. An evaluation of the material properties shows that plasma enhanced chemical vapor deposited borides formed at substrate temperatures of 800 °C, 850 °C, 900 °C and 1000 °C strengthen the material by increasing the hardness and elastic modulus of cemented tungsten carbide. Additionally, these boride surface layers may offer potential for adhesion of ultra-hard carbon coatings.

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“…The resulting transition metal-boride layer has been shown to be a good candidate for diamond coatings [12,[14][15][16]. We have shown this to be the case for medical grade cobalt-chromium alloy, which contains a substantially higher percentage of cobalt [17]. Furthermore, preliminary data taken from field tests has shown significant improvement in WC-Co longevity with diamond coating treatment, ranging from 400% for roof bolt drilling to 12000% in directional drilling [18].…”

Section: Introductionmentioning

confidence: 99%

Improved nanostructured diamond adhesion on cemented tungsten carbide with boride interlayers

Johnston

Baker

Catledge

2016

Diamond and Related Materials

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The application of diamond coatings for strengthening cemented tungsten carbide has been previously attempted, but suffers from delamination. Plasma enhanced chemical vapor deposition boriding improves the strength of cemented carbides by forming WCoB, W 2 CoB 2 , and/or CoB phases using controllable diborane stoichiometry;this research exploresthese borides as interlayers for nanostructured diamond coatings. Diamond deposition occurred between 600 °C and 1100 °C at 100 °C increments for 30 min to 4 hrs. Raman spectroscopy showed enhanced diamond growth compared to untreated WC-Co,however predominantlyWCoB and CoBphase interlayerssuffered from diamond film delamination. Examination by scanning electron microscopy and energy dispersive X-ray spectroscopy showed interfacial cobalt clusters on these interlayers. Predominantly W 2 CoB 2 phase interlayers showed improvement with a reduction in reactive cobalt, and improved adhesion of nanostructured diamond coatings. Diamond on W 2 CoB 2 was well adhered with deposition temperature dependentnanoindentationhardness ranging from 10 to 60 GPaand elastic modulus of 400 to 750 GPa. Scratch testing revealed cohesiveand adhesive failure of the diamond coatings at 5N ± 2N and 8N ±2N respectively and epoxy pull testing resulted in a surface adhesion tensile strength of 8.2 MPa ± .1MPa. The W 2 CoB 2 phaseis shown to be desirable as an interlayer for improved nanostructured diamondadhesion on cemented tungsten carbide.

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Plasma boriding of a cobalt–chromium alloy as an interlayer for nanostructured diamond growth

Cited by 29 publications

References 33 publications

Growth Kinetics of CoB–Co₂B Layers Using the Powder-Pack Boriding Process Assisted by a Direct Current Field

Growth Kinetics of CoB–Co₂B Layers Using the Powder-Pack Boriding Process Assisted by a Direct Current Field

Metal-boride phase formation on tungsten carbide (WC-Co) during microwave plasma chemical vapor deposition

Improved nanostructured diamond adhesion on cemented tungsten carbide with boride interlayers

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Plasma boriding of a cobalt–chromium alloy as an interlayer for nanostructured diamond growth

Cited by 29 publications

References 33 publications

Growth Kinetics of CoB–Co2B Layers Using the Powder-Pack Boriding Process Assisted by a Direct Current Field

Growth Kinetics of CoB–Co2B Layers Using the Powder-Pack Boriding Process Assisted by a Direct Current Field

Metal-boride phase formation on tungsten carbide (WC-Co) during microwave plasma chemical vapor deposition

Improved nanostructured diamond adhesion on cemented tungsten carbide with boride interlayers

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Growth Kinetics of CoB–Co₂B Layers Using the Powder-Pack Boriding Process Assisted by a Direct Current Field

Growth Kinetics of CoB–Co₂B Layers Using the Powder-Pack Boriding Process Assisted by a Direct Current Field