Plans for an upgraded CMS pixel detector

Bean, A.

doi:10.1016/j.nima.2010.11.085

Cited by 3 publications

(1 citation statement)

References 7 publications

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“…Pixel detectors are capable of coping with the large data rates at the LHC and can survive the large radiation fluences in the vicinity close to the collision point. Since the start of the LHC in 2009 they have proven to be precise and reliable detection devices [7,8,9,10,11]. In the context of the LHC upgrade program [12], in particular the expected increase in luminosity by up to a factor 10 compared to the present LHC design [13] and the corresponding increase in particle rates and radiation levels, strong constraints on detector layouts and materials are imposed.…”

Section: Introductionmentioning

confidence: 99%

Signal and noise of diamond pixel detectors at high radiation fluences

Tsung¹,

Havránek²,

Huegging³

et al. 2012

J. Inst.

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CVD diamond is an attractive material option for LHC vertex detectors mainly because of its strong radiation-hardness causal to its large band gap and strong lattice. In particular, pixel detectors operating close to the interaction point profit from tiny leakage currents and small pixel capacitances of diamond resulting in low noise figures when compared to silicon. On the other hand, the charge signal from traversing high energy particles is smaller in diamond than in silicon by a factor of about 2.2. Therefore, a quantitative determination of the signal-to-noise ratio (S/N) of diamond in comparison with silicon at fluences in excess of 10 15 n eq cm −2 , which are expected for the LHC upgrade, is important. Based on measurements of irradiated diamond sensors and the FE-I4 pixel readout chip design and performance, we determine the signal and the noise of diamond pixel detectors irradiated with high particle fluences. To characterize the effect of the radiation damage on the materials and the signal decrease, the change of the mean free path λ e/h of the charge carriers is determined as a function of irradiation fluence. We make use of the FE-I4 pixel chip developed for ATLAS upgrades to realistically estimate the expected noise figures: the expected leakage current at a given fluence is taken from calibrated calculations and the pixel capacitance is measured using a purposely developed chip (PixCap). We compare the resulting S/N figures with those for planar silicon pixel detectors using published charge loss measurements and the same extrapolation methods as for diamond. It is shown that the expected S/N of a diamond pixel detector with pixel pitches typical for LHC, exceeds that of planar silicon pixels at fluences beyond 10 15 particles cm −2 , the exact value only depending on the maximum operation voltage assumed for irradiated silicon pixel detectors.

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Section: Introductionmentioning

confidence: 99%

Signal and noise of diamond pixel detectors at high radiation fluences

Tsung¹,

Havránek²,

Huegging³

et al. 2012

J. Inst.

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Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications

Fritzsch

Jordan

Oppermann

et al. 2011

Nuclear Instruments and Methods in Physics Research Section A:

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PIXEL 2010 – A Résumé

Wermes

2011

Nuclear Instruments and Methods in Physics Research Section A:

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The Pixel 2010 conference focused on semiconductor pixel detectors for particle tracking/vertexing as well as for imaging, in particular for synchrotron light sources and XFELs. The big LHC hybrid pixel detectors have impressively started showing their capabilities. X-ray imaging detectors, also using the hybrid pixel technology, have greatly advanced the experimental possibilities for diffraction experiments. Monolithic or semi-monolithic devices like CMOS active pixels and DEPFET pixels have now reached a state such that complete vertex detectors for RHIC and superKEKB are being built with these technologies. Finally, new advances towards fully monolithic active pixel detectors, featuring full CMOS electronics merged with efficient signal charge collection, exploiting standard CMOS technologies, SOI and/or 3D integration, show the path for the future. This résumé attempts to extract the main statements of the results and developments presented at this conference.

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Plans for an upgraded CMS pixel detector

Cited by 3 publications

References 7 publications

Signal and noise of diamond pixel detectors at high radiation fluences

Signal and noise of diamond pixel detectors at high radiation fluences

Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications

PIXEL 2010 – A Résumé

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