2007 European Microwave Conference 2007
DOI: 10.1109/eumc.2007.4405537
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Planar limiters and receiver protectors

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Cited by 3 publications
(3 citation statements)
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“…We investigate the corresponding RF S-parameter properties up to 13.5 GHz and power handling capabilities for possible RF applications in high frequency filters, modulators, and active microwave device components. 3,5,[10][11][12][13][14][15][16] We show that high RF input power can reduce the resistance of VO 2 similarly as applied DC voltage. We compare transient and RF properties with published results on VO 2 and present lumped circuit element and 3D electromagnetic simulations that model the RF properties quite well.…”
Section: Introductionmentioning
confidence: 99%
“…We investigate the corresponding RF S-parameter properties up to 13.5 GHz and power handling capabilities for possible RF applications in high frequency filters, modulators, and active microwave device components. 3,5,[10][11][12][13][14][15][16] We show that high RF input power can reduce the resistance of VO 2 similarly as applied DC voltage. We compare transient and RF properties with published results on VO 2 and present lumped circuit element and 3D electromagnetic simulations that model the RF properties quite well.…”
Section: Introductionmentioning
confidence: 99%
“…Removing part of the PIN junction area using mesa construction can reduce the parasitic capacitance but detrimentally increases the diode's transient thermal impedance [ 6 ]. Alternatively, the Schottky diode can be isolated from the RF path with either a high-impedance quarter wave line [ 7 ] or directional coupler [8] - [9], but these passives add to either the size or the cost, and also increases the limiting threshold. The capacitive loading of the signal path can be reduced by connecting the diodes to a lower impedance (12.5 ohm) node [ 10 ], but the required impedance transformers are lossy and space-consuming.…”
Section: Introductionmentioning
confidence: 99%
“…This sheet beam topology is particularly of interest in the millimeter wave band devices at frequencies >100 GHz where the familiar P $ f 2 scaling no longer holds with a dramatic decrease in power observed in the "THz gap" that lies between the electronics and photonics areas of research. 9,10 In addition to the ability to transport higher power for reasonably efficient beam-wave interaction, the planar structures are relatively easier to fabricate using unconventional/MEMS fabrication schemes like LIGA, 11,12 EDM machining, 13,14 Si DRIE, 4 and nano-CNC milling. 11,12,15 This paper presents the RF transmission measurements (cold test) results of the Sheet Beam TWTA in the 170 GHz-270 GHz frequency range that is fabricated by state-of-the-art nano CNC-milling process 16 and diffusion bonded in a three layer topology.…”
Section: Introductionmentioning
confidence: 99%