Planar inverted F antenna loaded with high permittivity material

Hwang, Y.; Zhang, Y.P.; Zheng, Gao-Ting; Lo, T.K.C.

doi:10.1049/el:19951184

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Relative Radiation Quality Factor1

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Cited by 101 publications

(37 citation statements)

References 5 publications

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“…From (6) we see that increase in both and will increase the stored energy. In addition to this, the increase of stored energy due to frequency dispersion is also explicit in (6).…”

Section: Relative Radiation Quality Factormentioning

confidence: 99%

Magnetodielectric Substrates in Antenna Miniaturization: Potential and Limitations

Ikonen¹,

Rozanov

Осипов

et al. 2006

IEEE Trans. Antennas Propagat.

201

119

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“…From (6) we see that increase in both and will increase the stored energy. In addition to this, the increase of stored energy due to frequency dispersion is also explicit in (6).…”

Section: Relative Radiation Quality Factormentioning

confidence: 99%

Magnetodielectric Substrates in Antenna Miniaturization: Potential and Limitations

Ikonen¹,

Rozanov

Осипов

et al. 2006

IEEE Trans. Antennas Propagat.

201

119

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“…), one of the most commonly used miniaturization methods of microstrip antennas is loading of the antenna volume with dielectric materials [1][2][3][4]. However, a dielectric loading is known to lead to a dramatically reduced impedance bandwidth [5,6].…”

Section: Introductionmentioning

confidence: 99%

Microstrip antenna miniaturization using partial dielectric material filling

Luukkonen¹,

Ikonen²,

Tretyakov³

2006

Micro & Optical Tech Letters

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“…On the other hand, planar inverted-F antennas (PIFAs) [7][8][9][10][11][12] have also gained attention in the area of mobile communications. However, both types of antennas are primarily designed discretely from transceivers, which leads to extra assembly cost and footprint usage.…”

Section: Introductionmentioning

confidence: 99%

Design and analysis of integrated-circuit package antenna (ICPA) for dual-band wireless transceivers

Tong

Mei

Cao

et al. 2006

Int J RF and Microwave Comp Aid Eng

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This article presents study of a dual-band integrated-circuit package antenna (ICPA), which operates concurrently on dual bands at 2.4 and 5.25 GHz. The antenna is designed and printed on the top surface of an IC package and fed by a single coaxial line, while the transceiver is implemented on the opposite side of the package, through the separation of a common ground plate. This "cavity-down" arrangement minimizes the electromagnetic interference between the antenna and transceiver, and satisfies the miniaturization of the design. The study consists of numerical computations, which are performed through an in-house computer solver based on the nonuniform finite-difference time-domain (NU-FDTD) method and experimental measurements. Together with the data computed using the highfrequency structure simulator (HFSS) software, the results show excellent agreement between the numerical and experimental data, and the proposed structure is deemed as a useful application in the area of highly integrated wireless transceivers.

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Planar inverted F antenna loaded with high permittivity material

Cited by 101 publications

References 5 publications

Magnetodielectric Substrates in Antenna Miniaturization: Potential and Limitations

Magnetodielectric Substrates in Antenna Miniaturization: Potential and Limitations

Microstrip antenna miniaturization using partial dielectric material filling

Design and analysis of integrated-circuit package antenna (ICPA) for dual-band wireless transceivers

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