Planar Highly Efficient High-Gain 165 GHz On-Chip Antennas for Integrated Radar Sensors

Ahmad, Wael A.; Kucharski, Maciej; Serio, Adolfo Di; Ng, Herman Jalli; Waldschmidt, Christian; Kissinger, Dietmar

doi:10.1109/lawp.2019.2940110

Cited by 31 publications

(10 citation statements)

References 11 publications

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“…5, leakage into the substrate can be limited without affecting surrounding components. LBE is particularly well-suited for on-chip patch antennas and reflector-backed antennas, as the remaining silicon can act as a supporting spacer between the radiator and PCB-based ground plane [84], [85]. An end-fire quasi-Yagi-Uda design presented in [39] also achieved a good efficiency due to LBE, as the lossy substrate modes were significantly reduced.…”

Section: B Modifying the Silicon Bulkmentioning

confidence: 99%

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A Review of Design and Integration Technologies for D-Band Antennas

Kok

Smolders

Johannsen

2021

IEEE Open J. Antennas Propag.

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This article reviews the current state-of-the-art of millimeter-wave (mm-wave) antennas for communication and sensing applications in the D-band between 110 and 170 GHz. The most popular design techniques, including Antenna-on-Board (AoB), slotted waveguides, Antenna-in-Package (AiP) and Antenna-on-Chip (AoC), are described using relevant examples from scientific literature. Potential benefits and limitations of integration technologies, such as specialized packaging, chip post-processing steps and interconnects, are listed as well. The reported performances of all listed designs are compared against each other, taking the antenna size relative to operating frequency into account. This novel comparison indicates that small-scale integrated AiP and AoC designs can achieve competitive performance levels with short and low-loss interconnects.Index Terms-Antenna-in-Package, Antenna-on-Board, Antenna-on-Chip, D-band, millimeter-Wave This document is a result of the NEXTPERCEPTION project (www.nextperception.eu), which is jointly funded by the European Commission and national funding agencies under the ECSEL joint undertaking.

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Section: B Modifying the Silicon Bulkmentioning

confidence: 99%

“…In [11], [85] and [86], LBE was applied selectively around or underneath sections of the radiating element as illustrated in Fig. 5.…”

Section: B Modifying the Silicon Bulkmentioning

confidence: 99%

A Review of Design and Integration Technologies for D-Band Antennas

Kok

Smolders

Johannsen

2021

IEEE Open J. Antennas Propag.

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“…The same selective LBE technique was also utilized in [85] and [86] in order to solve mechanical instability issue, where 120 GHz double-folded AoC provides a good peak gain of 3 -5 dBi using 130 nm SiGe BiCMOS process. Likewise, the selective removal of Si substrate using LBE for two D-band AoCs, implemented using 130 nm SiGe BiCMOS process, has also been employed in [87]. Consequently, a folded dipole AoC achieves a peak gain of 5 dBi and radiation efficiency of 45 %, while the patch AoC obtains a peak gain of 6 dBi and radiation efficiency of above 60 %.…”

Section: B Recent Developments In Mm-wave Band (30-300 Ghz)mentioning

confidence: 99%

Performance-Issues-Mitigation-Techniques for On-Chip-Antennas – Recent Developments in RF, MM-Wave, and Thz Bands With Future Directions

2020

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“…In order to improve the AoC radiation performance, two approaches have been reported extensively in the literature [8,[12][13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29][30]. First, it involves incorporating off-chip microwave lenses or superstrates.…”

Section: Introductionmentioning

confidence: 99%

Ultra-Thin Artificial Magnetic Conductor for Gain Enhancement of Antenna-on-Chip

Akhter

Shamim

2022

IEEE Trans. Antennas Propagat.

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System-on-Chip (SoC) has become an attractive solution to achieve highly integrated wireless systems. However, the Antenna-on-Chip (AoC) suffers from poor radiation due to the lossy silicon substrate in standard CMOS processes. Artificial Magnetic Conductors (AMC) with the ground plane above the silicon can enhance the radiation, however, fitting the AMC completely in the thin stack-up (~10-15 μm) is extremely challenging, particularly for frequencies below 100 GHz. In this paper, Metallic Posts (MP) and Embedded Guiding Structures (EGS) have been investigated to reduce the AMC thickness by employing the available vias and metal layers in the stack-up. An in-house CMOS-compatible process has been used to realize the AoC, where typical low-conductivity adhesion layers have been avoided to reduce the undesired losses by using the surface roughness in a unique fashion. With MP and EGS approaches, AMC thickness can be reduced by 33% and 41% respectively. The AMC with EGS fits within an oxide of a thickness of 16 μm. A monopole antenna, backed by this AMC, demonstrates a gain of 5.85 dBi and radiation efficiency of 57% at 94 GHz, bettering the gain and radiation efficiency by 9.15 dB and 42% respectively as compared to the case without AMC.

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Planar Highly Efficient High-Gain 165 GHz On-Chip Antennas for Integrated Radar Sensors

Cited by 31 publications

References 11 publications

A Review of Design and Integration Technologies for D-Band Antennas

A Review of Design and Integration Technologies for D-Band Antennas

Performance-Issues-Mitigation-Techniques for On-Chip-Antennas – Recent Developments in RF, MM-Wave, and Thz Bands With Future Directions

Ultra-Thin Artificial Magnetic Conductor for Gain Enhancement of Antenna-on-Chip

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