PIXAPP Photonics Packaging Pilot Line – Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity

Bundalo, Ivan-Lazar; Morrissey, Padraic E.; Annoni, Andrea; Baets, Roel; Blache, F.; Breyne, Laurens; Carroll, Lee; Collins, Seán; Dietrich, Philipp; Halmo, Leos; Jorge, F.; Karppinen, M.; Kaunisto, Mikko; Kelly, Brian; Vankerrebrouck, Joris; Koos, Christian; Lahti, Markku; Lambrecht, Joris; Tienforti, Marcello; Lee, Jun Su; Missinne, Jeroen; Ossieur, Peter; Pessina, R; Sterken, Tom; Steenberge, Geert Van; Vannucci, A.; Vannucchi, Alessandro M.; Verplancke, Rik; Wuytens, Pieter; Xu, Yilin; Zoldak, Martin; O’Brien, Peter

doi:10.1109/jstqe.2022.3158891

Cited by 10 publications

(8 citation statements)

References 18 publications

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“…This study demonstrates the proof of concept for μTP of thick optical components using the UV-release tether-less method. First, 500 μm thick silicon (Si) and fused-silica (FS) wafers are diced on UV-curable dicing tape with the same dimension as a 1×4 array of Si and 1×8 array of FS micro-lenses 38 , 39 . These diced pieces are named “pseudo lenses.” The shear test of the pseudo lenses is performed using a Royce shear tester model 552 and compared with existing optical epoxies.…”

Section: Methodsmentioning

confidence: 99%

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Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Wakeel,

Morrisey,

Genc

et al. 2023

J. Optical Microsystems

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Micro-transfer printing (μTP) has been widely used to integrate photonic components, such as lasers, modulators, photodetectors, micro-LEDs, on Si photonic platforms. There is a push toward the μTP of optical components in photonics packaging as it enables wafer-scale integration with high alignment accuracy. We demonstrate for the first time the μTP of thick optical components, such as micro-lenses, in the range of 250 to 1000 μm thickness. We explore the reliability of bonding such components using an ultraviolet (UV) curable epoxy and compare them with the current state of the art. The results show that the average shear strength of lenses bonded with InterVia is 19 MPa which is higher than currently used optical epoxies. Also, μTP process has no effect on the surface roughness and microstructure of lenses. Using our approach, we demonstrate how thick silicon and fused silica lenses can be integrated into photonic integrated circuits (PICs) using a tether-free process that is highly scalable and robust.

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Section: Methodsmentioning

confidence: 99%

“…FCA250FS, 1 × 8 array, 250 μm array pitch, and 240 μm lens diameter) are used. 38,39 These lenses are placed on UV-curable dicing tape with 6-in. dicing frame.…”

Section: Device Fabrication and Releasementioning

confidence: 99%

Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Wakeel,

Morrisey,

Genc

et al. 2023

J. Optical Microsystems

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“…The captured rules altogether will form an Assembly Design Kit (ADK) in the software, in parallel to the Process Design Kit (PDK) of the PIC itself. Recently, the PIXAPP Photonics Pilot Line has demonstrated a transceiver assembled using an ADK-implemented process …”

Section: Standardizationmentioning

confidence: 99%

“…Recently, the PIXAPP Photonics Pilot Line has demonstrated a transceiver assembled using an ADK-implemented process. 179 Packaging Equipment. The Packaging Design Rules will not only have to be implemented at the package design stage through the ADKs, but rather their goal should be the automation of assembly and packaging.…”

Section: ■ Standardizationmentioning

confidence: 99%

Integrated Photonics Packaging: Challenges and Opportunities

et al. 2022

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Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the "packaging bottleneck".

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“…These breakthroughs demonstrate a promising path for manufacturing large-scale silicon photonic-electronic chips based on the rapid MPW prototyping service. By leveraging photonic packaging [16], such as photonic wire bonding [17] and flip-chip die bonding for photonic-electronic co-integration [18], silicon photonic chips can be calibrated, reprogrammed, and trained efficiently by using electronic microcontrollers with high reproducibility for neuromorphic computing [19,20].…”

Section: Introductionmentioning

confidence: 99%

Fabrication and integration of photonic devices for phase-change memory and neuromorphic computing

Zhou,

Shen,

Yang

et al. 2024

Int. J. Extrem. Manuf.

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In the past decade, there has been tremendous progress in integrating chalcogenide phase-change materials (PCMs) on the silicon photonic platform for non-volatile memory to neuromorphic in-memory computing applications. Especially, these non von Neumann computational elements and systems benefit from mass manufacturing of silicon photonic integrated circuits (PICs) on 8-inch wafers using 130-nm complementary metal-oxide semiconductor (CMOS) line. Chip manufacturing based on the deep-ultraviolet (DUV) lithography and electron-beam lithography (EBL) enable rapid prototyping of PICs, which can be integrated with high-quality PCMs based on the wafer-scale sputtering technique as a back-end-of-line (BEOL) process. In this article, we overview recent advances of waveguide integrated PCM memory cells, functional devices, and neuromorphic systems, with an emphasis on fabrication and integration processes to attain the state-of-the-art device performance. After a short overview of PCM based photonic devices, we discuss the materials properties of the functional layer as well as the progress on the light guiding layer, namely, the silicon and germanium waveguide platforms. Next, we discuss the cleanroom fabrication flow of waveguide devices integrated with thin films and nanowires, silicon waveguide and plasmonic microheaters for electrothermal switching of PCMs and mixed-mode operation. Finally, the fabrication of photonic and photonic-electronic neuromorphic computing systems is reviewed. These systems consist arrays of PCM memory elements for associative learning, matrix-vector multiplication, and pattern recognition. With large-scale integration, neuromorphic photonic computing paradigm holds the promise to outperform digital electronic accelerators by taking the advantages of ultra-high bandwidth, high speed, and energy efficient operation in running machine learning algorithms.

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PIXAPP Photonics Packaging Pilot Line – Development of a Silicon Photonic Optical Transceiver With Pluggable Fiber Connectivity

Cited by 10 publications

References 18 publications

Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Integrated Photonics Packaging: Challenges and Opportunities

Fabrication and integration of photonic devices for phase-change memory and neuromorphic computing

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