2023
DOI: 10.1016/j.corsci.2022.110901
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Pitting corrosion – Preferred chloride diffusion pathways in physical vapor deposited AlCrN coatings

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Cited by 8 publications
(5 citation statements)
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“…The respective HR-TEM (a) image features a well-defined column-boundary, which would, in case of a subsequent corrosion experiment, offer a preferential diffusion path for chloride species. Such fast track diffusion pathways for chloride species have been investigated in a previous study [1], and deemed to be a significant draw-back in effectively providing corrosion protection. As vanadium is substituted for chromium, first to 11.6 at% (P7) and then further to 22.3 at% V-content (P10), the SAEDs feature…”
Section: Microstructure and Composition Analysismentioning
confidence: 99%
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“…The respective HR-TEM (a) image features a well-defined column-boundary, which would, in case of a subsequent corrosion experiment, offer a preferential diffusion path for chloride species. Such fast track diffusion pathways for chloride species have been investigated in a previous study [1], and deemed to be a significant draw-back in effectively providing corrosion protection. As vanadium is substituted for chromium, first to 11.6 at% (P7) and then further to 22.3 at% V-content (P10), the SAEDs feature…”
Section: Microstructure and Composition Analysismentioning
confidence: 99%
“…When considering that porosities and fast track diffusion sites along incoherent grain boundaries contribute to a more anodically active galvanic couple (coating/alloy), control over the open porosity of protective coatings is of great importance [1]. Therefore, we would like to put the aforementioned electrochemical data in context with the open porosity values (Eqs.1-2).…”
Section: Open Porosity Vs V-contentmentioning
confidence: 99%
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“…This is due to their ability to reduce friction in metal forming dies, withstand mechanical and thermal loads during cutting procedures, and improve the mechanical and tribological properties, as well as the corrosion resistance of metals. This can be attributed to several factors, including the excellent resistance to oxidation, its short interatomic distance, and the formation of adherence and dense Al 2 O 3 films during service 12–14 . Several methods have been developed and utilized for producing thin metallic nitride films on solid substrates, including physical vapor deposition (PVD) and chemical vapor deposition (CVD).…”
Section: Introductionmentioning
confidence: 99%
“…This can be attributed to several factors, including the excellent resistance to oxidation, its short interatomic distance, and the formation of adherence and dense Al 2 O 3 films during service. [12][13][14] Several methods have been developed and utilized for producing thin metallic nitride films on solid substrates, including physical vapor deposition (PVD) and chemical vapor deposition (CVD). Sputtering involves the evaporation of materials from a target source on the substrate by highenergy ions.…”
Section: Introductionmentioning
confidence: 99%