Picosecond lasers in micromachining

Račiukaitis, Gediminas; Jacinavičius, Saulius; Brikas, Marijus; Balickas, Stanislovas

doi:10.2351/1.5060116

Cited by 7 publications

(4 citation statements)

References 13 publications

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“…Laser ablation experiments were performed on the workstation that included a laser, the beam delivery system with harmonics generation, focusing head and XY and Z stages [11]. Two different lasers were used in experiments.…”

Section: Experimental Set-upmentioning

confidence: 99%

Investigation of UV picosecond laser ablation of polymers

Gedvilas¹,

Račiukaitis²

2005

SPIE Proceedings

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UV picosecond laser pulses have been shown to be able to etch clean holes in polymers. This process has numerous applications in processing polymers. We present the results obtained by the investigation of the laser ablation process with picosecond pulses in 19 different organic materials. Micro-drilling and cutting of polymers were performed by the 355 and 266 nm radiation. The ablation rate versus laser fluence was investigated. Polymers showed the logarithmic ablation rate versus the laser fluence proving a well known Beer's model of laser ablation. Two ablation thresholds were observed in most of the polymers. One of them was below 1 J/cm 2 with a low material removal rate. Another threshold was spread in the range of 3 -30 J/cm 2 and a rapid increase in the ablation rate was found above it.The processing of polymers was tested in fabrication of cavities relevant to different micro-devices. Combined cavities for the ink-jet printer head and micro-fluidic set were formed by laser etching. UV laser radiation with the picosecond pulse duration can be useful in manufacturing micro-systems for diverse technical applications.

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Section: Experimental Set-upmentioning

confidence: 99%

Investigation of UV picosecond laser ablation of polymers

Gedvilas¹,

Račiukaitis²

2005

SPIE Proceedings

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“…16) Further shortening of the Ce:LiCAF laser pulse duration is needed to fully realize its potential as an all-solid-state UV short pulse laser medium. It is well known that UV lasers have many applications in various fields such as surface structuring, [17][18][19] micromachining, 20) remote sensing, 21) spectroscopy, and imaging. 22) An important advantage of having ultrashort UV pulses, especially in micromachining is that the peak power is high therefore limiting material modification to the area around the laser focus.…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation of ultraviolet picosecond Ce:LiCAF laser emission by optimized resonator transients

Pham

Cadatal-Raduban

Luong

et al. 2014

Jpn. J. Appl. Phys.

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We perform numerical simulations to investigate the spectro-temporal evolution of broadband ultraviolet (UV) laser emission from Ce:LiCAF, modeled as a system of two homogeneous broadened singlet states, using the resonator transient method. Results show that a short-pulse Ce:LiCAF UV laser emission can be achieved by choosing a cavity with the appropriate photon cavity lifetime and by controlling the pump energy. Numerical simulations were performed to determine the optimum Q-value and cavity length that will make the photon cavity lifetime small compared to the pump pulse duration. A single 31.5 ps laser pulse with about 10 µJ output energy can be generated in principle from a 1 mm, 1 mol % Ce 3+ -doped LiCAF crystal using a low-Q (30% output coupler reflectivity), short cavity (2 mm cavity length) oscillator pumped by 75 ps laser pulses and 140 µJ pump energy. With these transient cavity parameters, a slope efficiency of about 10% is feasible. This technique can be extended to other fluoride-based solid-state laser gain media.

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“…Laser ablation experiments were performed on the workstation that included a laser, the beam delivery system with harmonics generation, focusing head and XY and Z stages [9]. Two different lasers were used in experiments.…”

Section: Experimental Set-upmentioning

confidence: 99%

Processing of polymers by UV picosecond lasers

Račiukaitis¹,

Gedvilas²

2005

International Congress on Applications of Lasers &Amp; Electro-Optics

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Laser micromachining has been proven an excellent technique for patterning many engineering materials. The emitted photon energy from a UV laser is high enough to break the chemical bonds of the target reducing the heat effects on surrounding material. We present the results obtained by investigation of the laser ablation processes with picosecond pulses in about 20 different organic materials. Micro-drilling and cutting of polymers were performed by the 266nm radiation. The effect of laser fluence on the ablation rate and drilling depth was investigated. Most of the materials showed two ablation thresholds. One of them was below 1 J/cm 2 with a low material removal rate. Another threshold was spread in the range of 3-30 J/cm 2 and the rapid increase in the ablation rate was found above it. The results are discussed in connection with optical ant thermal properties of the materials. The thermal activation of the ablation plays an important role at low fluences. The processing regimes of polymers were proved at formation of microstructures. UV laser radiation with the picosecond pulse duration can be useful in manufacturing micro-systems for diverse technical applications.

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Picosecond lasers in micromachining

Cited by 7 publications

References 13 publications

Investigation of UV picosecond laser ablation of polymers

Investigation of UV picosecond laser ablation of polymers

Numerical simulation of ultraviolet picosecond Ce:LiCAF laser emission by optimized resonator transients

Processing of polymers by UV picosecond lasers

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