Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Rimolo-Donadío, Renato; Gu, Xiaoxiong; Kwark, Young; Ritter, Mark B.; Archambeault, Bruce; Paulis, Francesco de; Zhang, Yaojiang; Fan, Jun; Brüns, Heinz-Dietrich; Schuster, Christian

doi:10.1109/tmtt.2009.2025470

Cited by 156 publications

(52 citation statements)

References 26 publications

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“…For striplines, a modal decomposition approach has been proposed [45], [46]. Using this approach, the orthogonal parallel-plane and stripline modes are modelled independently, and then the modal behaviors are combined at the ends of the striplines.…”

Section: Traces Components and Slotsmentioning

confidence: 99%

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

Fan

Paulis

et al. 2010

IEICE Trans. Commun.

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SUMMARYNoise coupling on the power distribution networks (PDN) or between PDN and signal traces is becoming one of the main challenges in designing above GHz high-speed digital circuits. Developing an efficient and accurate modeling method is essential to understand the noise coupling mechanism and then solve the problem afterwards. In addition, development of new noise mitigation technology is also important for future high-speed circuit systems. In this invited paper, a novel modeling methodology that is based on the physics-based equivalent circuit model will be introduced, and an example of multiple layer PCB circuits will be modeled and validated with good accuracy. Based on the periodic structure concept, several new electromagnetic bandgap structures (EBG), such as coplanar EBG, photonic crystal power layer (PCPL), and ground surface perturbation lattice (GSPL), will be introduced for the mitigation of power/ground noise. The trade/offs of all these structures will be discussed.

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Section: Traces Components and Slotsmentioning

confidence: 99%

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

Fan

Paulis

et al. 2010

IEICE Trans. Commun.

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“…Based on measurements, full-wave simulations and physics-based via models [3], a general characterization of vias and the via stub is made in the first part of this work in order to establish the equivalence to transmission lines below 20 GHz as reported in other publications [4]. Arguing from this equivalence the application of single and double via stubs in a matching network will be shown.…”

Section: Introductionmentioning

confidence: 96%

Double stub matching in multilayered printed circuit board using vias

Hardock

Rimolo-Donadío

Brüns

et al. 2012

2012 IEEE 62nd Electronic Components and Technology Conference

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In this paper the authors present the application of functional vias to narrowband load matching in the frequency range from 2 up to 20 GHz. The utilization of single and double stub matching is demonstrated. Corresponding network parts basically contain one or two via stubs and transmission line elements, e. g. striplines and microstrips. It is also shown that in most of the given frequency range vias and via stubs can be characterized as transmission lines. Especially the influence of the via configuration on the characteristic impedance and the propagation constant are analyzed in order to investigate their feasibility for matching purposes. Influences are the via length, the number of adjacent ground vias and their distance to the signal via. The analysis is done for open and shorted vias and is based on measurements, fullwave simulations and physics-based via models. Examples include matching networks with inductive loads up to several nH. IntroductionVias are essential components of multilayered printed circuit boards (PCBs) for both digital and analog applications. They provide intralevel electrical interconnections for signal and power distribution networks. It is well known though that at frequencies when the dimensions of a PCB get into the range of the wavelength, vias may show severe parasitic effects that can have detrimental impacts on e.g. the bandwidth of digital links [1]. A major contributor to these parasitic effects is the so-called via stub -any part of a via that is not an element of the direct signal path -since via stubs show a resonant behavior similar to open transmission lines due to wave effects. As a consequence open via stubs may act as electric shorts at their opposite ends resulting in near-zero signal transmission. However, in another perspective open via stubs may be considered as vertically integrated transmission lines that can be used for typical RF applications such as stub matching [2].Based on measurements, full-wave simulations and physics-based via models [3], a general characterization of vias and the via stub is made in the first part of this work in order to establish the equivalence to transmission lines below 20 GHz as reported in other publications [4]. Arguing from this equivalence the application of single and double via stubs in a matching network will be shown. Open and shorted stub matching and the impact of the via geometry will be demonstrated to match inductive loads up to 3 nH. Figure 1 illustrates the basic geometry of such a matching configuration.

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“…The second one often shows better results [3,4] without any theoretical reason. Analytical and semi-analytical models are presented in [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Analysis of a Vertical Interconnection Access by Using Longitudinal Wave Concept Iteratve Process (Lwcip)

Sboui¹,

Hajri²,

Baudrand³

2015

PIER M

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Abstract-A new formulation of the Wave Concept Iterative Process (WCIP) method is presented in this work. This approach uses an analysis with the longitudinal components instead of the transverse components. This approach includes decomposing the transverse TM modes into two longitudinal terms: the TM and TEM modes. This approach is applied to model a Vertical Interconnect Access VIA hole. The current density behavior is studied in the two cases with and without VIA hole. Also this method is used to study a SIW slot antenna. Compared to those obtained by available published data, our results show that the proposed method gives convincing results.

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Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Cited by 156 publications

References 26 publications

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

Double stub matching in multilayered printed circuit board using vias

Analysis of a Vertical Interconnection Access by Using Longitudinal Wave Concept Iteratve Process (Lwcip)

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