Future Trends in Microelectronics 2013
DOI: 10.1002/9781118678107.ch4
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Physics and Design of Nanoscale Field Effect Diodes for Memory and ESD Protection Applications

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“…This phenomenon contributes to reducing power dissipation in the S-FED-based circuits. On the other hand, each M-FED used in digital VLSI designs can act as an nMOS or an pMOS; while, a pair of identical S-FEDs with the same geometries can be used in both pull-up and pull-down networks to design robust dynamic logic gates [36,39], memory cells [37,40], multiplexers [41], and electrostatic discharge protection components [42,43]. These CMOS-like configurations not only enjoy enhanced noise margin and reduced power dissipation but also suppress the area overhead taking the same width-to-length ratio into account in all S-FEDs.…”
Section: Introductionmentioning
confidence: 99%
“…This phenomenon contributes to reducing power dissipation in the S-FED-based circuits. On the other hand, each M-FED used in digital VLSI designs can act as an nMOS or an pMOS; while, a pair of identical S-FEDs with the same geometries can be used in both pull-up and pull-down networks to design robust dynamic logic gates [36,39], memory cells [37,40], multiplexers [41], and electrostatic discharge protection components [42,43]. These CMOS-like configurations not only enjoy enhanced noise margin and reduced power dissipation but also suppress the area overhead taking the same width-to-length ratio into account in all S-FEDs.…”
Section: Introductionmentioning
confidence: 99%