2009
DOI: 10.1134/s0036024409120231
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Physicochemical processes at the boundary between some semiconducting solid solutions and contact alloys

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Cited by 3 publications
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“…4 Furthermore, the coating adhesion to the damaged layer will differ from that to a grain-oriented material. It was shown 5 that coating delamination occurs along the damaged layer where the cleavage planes are not perpendicular to the surface, as for the growth texture, but are parallel or at a slight slope angle to the surface.…”
Section: Resultsmentioning
confidence: 99%
“…4 Furthermore, the coating adhesion to the damaged layer will differ from that to a grain-oriented material. It was shown 5 that coating delamination occurs along the damaged layer where the cleavage planes are not perpendicular to the surface, as for the growth texture, but are parallel or at a slight slope angle to the surface.…”
Section: Resultsmentioning
confidence: 99%