Physical, Thermal Transport, and Compressive Properties of Epoxy Composite Filled with Graphitic- and Ceramic-Based Thermally Conductive Nanofillers

Abstract

Epoxy polymer composites embedded with thermally conductive nanofillers play an important role in the thermal management of polymer microelectronic packages, since they can provide thermal conduction properties with electrically insulating properties. An epoxy composite system filled with graphitic-based fillers; multi-walled carbon nanotubes (MWCNTs), graphene nanoplatelets (GNPs) and ceramic-based filler; silicon carbide nanoparticles (SiCs) was investigated as a form of thermal-effective reinforcement for epoxy matrices. The epoxy composites were fabricated using a simple fabrication method, which included ultrasonication and planetary centrifugal mixing. The effect of graphite-based and ceramic-based fillers on the thermal conductivity was measured by the transient plane source method, while the glass transition temperature of the fully cured samples was studied by differential scanning calorimetry. Thermal gravimetric analysis was adopted to study the thermal stability of the samples, and the compressive properties of different filler loadings (1–5 vol.%) were also discussed. The glass temperatures and thermal stabilities of the epoxy system were increased when incorporated with the graphite- and ceramic-based fillers. These results can be correlated with the thermal conductivity of the samples, which was found to increase with the increase in the filler loadings, except for the epoxy/SiCs composites. The thermal conductivity of the composites increased to 0.4 W/mK with 5 vol.% of MWCNTs, which is a 100% improvement over pure epoxy. The GNPs, SiCs, and MWCNTs showed uniform dispersion in the epoxy matrix and well-established thermally conductive pathways.

Significantly enhanced thermally conductive epoxy composite composed of caterpillar-like structured expanded graphite/ boron nitride nanotubes

“…Composites with direct blending of fillers have high interfacial thermal resistance and cannot achieve high loadings. 39 Horizontally-oriented fillers result in low through-plane thermal conductivity. [40][41][42] The wellconducted thermal pathway is established by the threedimensional structure of the filler.…”

Investigating of epoxy nanocomposites structure and properties that contain both pristine and aminosilane-treated silicon carbide (SiC) particles

“…A significant increase in the glass transition temperature by 39°C and the dynamic modulus of elasticity (storage modulus) by 55% were noted, which led to an increase in cross-link density and polymer efficiency coefficient. Samsudin et al 31 used MWCNTs, graphene nanoplatelets (GNPs) and SiC particles to modify the epoxy composition. The addition of up to 5 vol% MWCNTs, GNPs and SiC made it possible to increase the composites thermal conductivity by 100%, 80% and 40%, respectively, which is explained by the formation of a three-dimensional thermal conductive network inside the composite.…”

Microwave Modification of an Epoxy Basalt-Filled Oligomer to Improve the Functional Properties of a Composite Based on It

“…The addition of fillers makes it possible to increase the strength of epoxy composites, giving them specific physicochemical properties [7][8][9][10][11]. Epoxy polymer composites filled with heat-conducting nanofillers can provide thermal conductivity properties with electrical insulating properties [12]. The addition of 50% by weight carbide fillers significantly increases strength and modulus of elasticity during compression of epoxy composites with a decrease in shrinkage and an increase in adhesion to steel (at normal fracture) [13].…”