2003
DOI: 10.1143/jjap.42.1375
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Physical Properties of Highly Conformal TiN Thin films Grown by Atomic Layer Deposition

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Cited by 31 publications
(26 citation statements)
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“…Such an increase in growth rate with deposition temperature was also reported by others for similar ALD processes. 33,34 Ex situ XRR measurements were carried out to measure the film thickness for TiN films deposited at H-terminated c-Si substrates; however, the films were deposited with a different number of cycles compared to the films listed in Table II. Therefore, the growth rate obtained from both techniques will be compared.…”
Section: Physical Properties Tin Filmsmentioning
confidence: 99%
“…Such an increase in growth rate with deposition temperature was also reported by others for similar ALD processes. 33,34 Ex situ XRR measurements were carried out to measure the film thickness for TiN films deposited at H-terminated c-Si substrates; however, the films were deposited with a different number of cycles compared to the films listed in Table II. Therefore, the growth rate obtained from both techniques will be compared.…”
Section: Physical Properties Tin Filmsmentioning
confidence: 99%
“…However, these films become dielectric below 5 nm and may not be useful for nanophotonic applications . This is because TiN thin films grown using ALD with a TiCl 4 precursor are more prone to Cl impurities, which could result in a degradation of the metallic properties in thinner films …”
Section: Introductionmentioning
confidence: 99%
“…In order to deposit thin films of TiN on various substrates, it is common to use processes such as physical vapor deposition (PVD) [ 8 ], chemical vapor deposition (CVD) [ 9 ], atomic layer deposition (ALD) [ 10 ], and hallow cathode ionic plating (HCIP). Among those processes, the PVD process is known to be easy and to present a good adhesion between the film and the substrates of metals and ceramics [ 11 ].…”
Section: Introductionmentioning
confidence: 99%