Physical, Electrical, and Reliability Characterization of Ru for Cu Interconnects

Yang, Chen-Chi; Spooner, T.; Ponoth, S.; Chanda, Kaushik; Simon, A.; Lavoie, C.; Lane, Michael; Hu, C.‐K.; Liniger, E.; Gignac, L.; Shaw, T. M.; Cohen, S.; McFeely, F. R.; Edelstein, D.

doi:10.1109/iitc.2006.1648684

Cited by 38 publications

(29 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This facilitates the improved particle to particle contact [20,27,28]. In addition, the observed results could be due to good adhesion of copper with ruthenium [29]. The Ru content might aid in filling of the voids or pores which resulted in particle to particle interlocking.…”

Section: Density and Porositymentioning

confidence: 98%

Synthesis and characterization of sub-micron sized copper–ruthenium–tantalum composites for interconnection application

Sule

Olubambi

Abe

et al. 2012

Microelectronics Reliability

View full text Add to dashboard Cite

Section: Density and Porositymentioning

confidence: 98%

Synthesis and characterization of sub-micron sized copper–ruthenium–tantalum composites for interconnection application

Sule

Olubambi

Abe

et al. 2012

Microelectronics Reliability

View full text Add to dashboard Cite

“…Spark plasma sintering involves (relative piston travel as an indirect measure of densification and changes in the thickness of a sample die to movement of punches against the die with time is indicated by displacement [14][15][16]. The expansion or shrinkage is as a result of displacement towards the negative or positive direction [17].…”

Section: Sintering Behaviours Of the Mixed Powders During Spark Plasmmentioning

confidence: 99%

High Temperature Oxidation Resistance of Ni22Cr11Al Bond Coat Produced by Spark Plasma Sintering as Thermal Barrier Coatings

FIS¹,

PA²

2016

J Material Sci Eng

View full text Add to dashboard Cite

Thermal barrier coating (TBC) system is used in both aero engines and other gas turbines offer oxidation protection to super alloy substrate component. In the present work, it shows the ability of a new fabrication technique to develop rapidly new coating composition and microstructure. The compact powder were prepared by powder metallurgy method involving powder mixing and the bond coat was synthesized through the application of spark plasma sintering (SPS) at 1100°C, 1050°C and 1100°C to produce a fully dense 94%) Ni 22 Cr 11 Al bulk samples.The influence of sintering temperature on hardness of Ni 22 Cr 11 Al done by micro vickers hardness tester was investigated. And oxidation test were carried out at 1100°C for 20 hr, 40 hr and 100 hr. The resulting coat was characterised with Optical microscopy, Scanning electron microscopy (SEM) and X-ray diffraction (XRD). Micro XRD analysis after the oxidation test revealed the formation of protective oxides and non-protective oxides.

show abstract

“…Soo et al reported that ALD-Ru (4 nm)/ALD-TaCN (2 nm) prevented copper diffusion up to 550 1C and increasing the ALD-Ru to 12 nm prevented the diffusion of copper up to a temperature of 600 1C for 30 min [9]. However, Yang et al [10] reported that a thin layer of Ru by itself was not a sufficient barrier layer and suggested that Ru on TaN forms a better barrier than TaN alone.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical atomic layer deposition of copper nanofilms on ruthenium

Gebregziabiher

Kim

Thambidurai

et al. 2010

Journal of Crystal Growth

View full text Add to dashboard Cite

Physical, Electrical, and Reliability Characterization of Ru for Cu Interconnects

Cited by 38 publications

References 3 publications

Synthesis and characterization of sub-micron sized copper–ruthenium–tantalum composites for interconnection application

Synthesis and characterization of sub-micron sized copper–ruthenium–tantalum composites for interconnection application

High Temperature Oxidation Resistance of Ni22Cr11Al Bond Coat Produced by Spark Plasma Sintering as Thermal Barrier Coatings

Electrochemical atomic layer deposition of copper nanofilms on ruthenium

Contact Info

Product

Resources

About