Proceedings of the 2013 ACM International Symposium on Physical Design 2013
DOI: 10.1145/2451916.2451920
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Physical-aware system-level design for tiled hierarchical chip multiprocessors

Abstract: Tiled hierarchical architectures for Chip Multiprocessors (CMPs) represent a rapid way of building scalable and power-efficient many-core computing systems. At the early stages of the design of a CMP, physical parameters are often ignored and postponed for later design stages. In this work, the importance of physical-aware system-level exploration is investigated, and a strategy for deriving chip floorplans is described. Additionally, wire planning of the on-chip interconnect is performed, as its topology and … Show more

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Cited by 2 publications
(2 citation statements)
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“…The layout may be constrained by external factors such as wire placing, connectivity towards the outside of the core or to other on-chip elements [67] (i.e. NVM, interconnection networks, memory controllers, etc), and the need to manage thermal hotspots [68] [69]. At the same time, to dominate the complexity of floor-planning in processors that have billions of transistors, methodologies exploiting modules with regular designs are more and more widely adopted [70].…”
Section: Introductionmentioning
confidence: 99%
“…The layout may be constrained by external factors such as wire placing, connectivity towards the outside of the core or to other on-chip elements [67] (i.e. NVM, interconnection networks, memory controllers, etc), and the need to manage thermal hotspots [68] [69]. At the same time, to dominate the complexity of floor-planning in processors that have billions of transistors, methodologies exploiting modules with regular designs are more and more widely adopted [70].…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, wire-planning has to be performed to verify routability of the produced floorplans. The initial work in this direction has justified the importance of physical planning for CMP architectural exploration [46], [37].…”
Section: Future Workmentioning
confidence: 99%