Physical and chemical structure change of filled epoxy due to water absorption

Kumazawa, T.; Oishi, Manabu; Todoki, Minoru; Watanabe, Taizo

doi:10.1109/icpadm.1997.617644

Cited by 9 publications

(6 citation statements)

References 4 publications

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“…With the use of a FTIR spectrometer, water layers of a few hundred nm have been measured at an epoxy/glass interface [10]. This order of magnitude is in accordance with the MEB observations reported in [3]. Water may accumulate at the interfaces and lead to a filler/matrix debonding, which may be followed by mechanical cracks 1-4244-0750-8/07/$20.00 ©2007 IEEE.…”

Section: Introductionsupporting

confidence: 70%

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Hygrothermal aging of a filled epoxy resin

Brun

Rain

Gmllermin

et al. 2007

2007 IEEE International Conference on Solid Dielectrics

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The hygrothermal conditioning of an epoxy resin at 80°C under 80% RH has been followed by weight measurements, thermogravimetric analysis (TGA) and dynamical mechanical analysis (DMA). The samples are either filled with 60% by weight of silica flour or are not filled. Above an apparent saturation value of about 1.5% reached within a few days, a slight but significant mass uptake was observed in the filled resin, especially after 50 days. The TGA showed an evolution of the filled samples with conditioning after 50 days as well, which was not observed on unfilled samples. For the filled samples, the elastic modulus in the rubbery state decreased with conditioning. These evolutions have been attributed to the formation of a degraded inter-phase region due to hydrolysis occurring after the debonding of the filler-matrix interface caused by the absorbed water.

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Section: Introductionsupporting

confidence: 70%

“…As concerns the electrical rigidity, the breakdown voltages of wet materials may fall by a factor of 5 to 10 in comparison with a dry material [1][2][3]. In composites, the interfaces between the matrix and the mineral fillers are known to be zones of weakness [4][5][6].…”

Section: Introductionmentioning

confidence: 98%

Hygrothermal aging of a filled epoxy resin

Brun

Rain

Gmllermin

et al. 2007

2007 IEEE International Conference on Solid Dielectrics

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“…However, resistivity also depends on the material water content, for example, the epoxy resin mentioned in [7], shows a variation in its resistivity from 10 18 to 10 10 when the water content on the epoxy rose to 2.5% as it can be seen in Fig. 1.…”

Section: Resistivity and Rhmentioning

confidence: 94%

Section: Introductionmentioning

confidence: 99%

“…However, significant research has been focused on certain materials used in the manufacturing of electronic equipment [7], [8] and [9]. In [7] a study of resistivity change in Bakelite (a specific thermal compound) as a function of temperature and humidity is presented. Similarly, in [8] a study of water absorption in epoxy composites is presented, where the electrical and mechanical properties of the composites significantly vary with water absorption.…”

Section: Introductionmentioning

confidence: 99%

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Modeling effects of relative humidity, moisture, and extreme environmental conditions on power electronic performance

Ciprian

Lehman

2009

2009 IEEE Energy Conversion Congress and Exposition

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Variations in the behavior of power supplies caused by environmental conditions require accurate characterization of the electrical behavior dependence with environmental conditions. This paper introduces models to help predict RH and other environmental factors influence on sensitive circuitry in power electronic systems. An application example of a high power density, high voltage DC-DC converter is used to verify the results.

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