2018 European Conference on Optical Communication (ECOC) 2018
DOI: 10.1109/ecoc.2018.8535426
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Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production

Abstract: We give an overview of our research towards exploiting direct-write 3D laser lithography as a tool for advanced photonic integration. The technique offers new perspectives for a wide variety of applications, ranging from photonic wire bonding and multi-chip integration of high-speed communication engines to facet-attached beam-shaping elements and highly efficient coupling in astrophotonic systems. We are currently working on transferring the concept from laboratory demonstrations to industrial manufacturing.

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