Photonic-System-in-package (pSiP): miniaturization, panel level assembly, and optical waveguide integration in thin glass substrates

Abstract

In this paper, we discuss a hybrid photonic packaging platform that reduces module size by enhancing the functionality of glass-based substrates, frames and caps featuring electrical, thermal, mechanical, and optical functions. Furthermore, the substrates can be functionalized with integrated optical waveguides by means of thermal ion exchange. New results for low loss bending's will be discussed. The packaging approach offers the possibility to integrate beam forming optics and further (optical) components within the miniaturized photonic module. This serves clients who do not want to cope with alignment of single micro-optics, which is inherently a tight tolerance process, but instead want to have a surfacemountable device that provides certain optical inputs and outputs which can be interconnected in a defined manner, i.e. a collimated beam or fiber coupling. As an example, we present modular photonic subsystems that enable complex configurations such as master oscillator power amplifier (MOPA). Panel-level manufacturing and high precision automated assembly techniques on panel-level are demonstrated. Laser-based sealing processes using metal absorption structures are demonstrated to form metallic bonds between glass layers. Singulation of the panel stack at the end of the process chain ensures streamlined handling and allows for cost effective manufacturing.