2005
DOI: 10.1002/sia.1966
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Photoluminescence characterization of nano‐size defects in sub‐surface region of silicon wafers

Abstract: The sub-surface defects in annealed wafers with an oxide layer are characterized by ultraviolet-excited photoluminescence spectroscopy and mapping. Two types of defects are detected as a reduction of bandedge emission in the region determined to be defect-free by laser scattering tomography (LST): an interface gap state between silicon and the oxide layer, and a nitrogen-related defect (which is below the detection limit of LST).

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“…However, the intensity of PL band was increased for BM g-C 3 N 4 and decreased for BM+HT g-C 3 N 4 , respectively. Generally, the PL process is largely governed by the presence of defects since they act as recombination centers for photogenerated electrons and holes [22] . In our case, the ball milling may increase the density of defects in g-C 3 N 4 , and therefore improve the PL intensity.…”
Section: Resultsmentioning
confidence: 99%
“…However, the intensity of PL band was increased for BM g-C 3 N 4 and decreased for BM+HT g-C 3 N 4 , respectively. Generally, the PL process is largely governed by the presence of defects since they act as recombination centers for photogenerated electrons and holes [22] . In our case, the ball milling may increase the density of defects in g-C 3 N 4 , and therefore improve the PL intensity.…”
Section: Resultsmentioning
confidence: 99%