Photoelastic Investigation on Plates with Single Interference-Fit Pins with Load Applied to Plate Only

Abstract

SummaryThe introduction of an interference-fit pin in a circular hole in a flat plate is found to result in a reduction in the stress concentration factor at the hole boundary under tension applied to the plate. The S.C.F. decreases rapidly with increase in the ratio of interference stress to applied tension, and decreases also with increase in the ratio of hole diameter to width of plate. Very little difference in the S.C.F. is found for different ratios of Young's modulus of pin and plate.

Stress distributions around the interference fit between a round pin and a perforated finite plate

“…Other works, always for specific configurations, analyse the contact pressure between pin and a finite plate when subjected to an external load acting in the longitudinal plane of the plate [Jessop et al [4], Cox et al [5], Rao et al [6], Mather et al [7], Rao [8], Murthy et al [9]]. Goel et al [10] perform a numerical thermo-mechanical analysis to evaluate the effect of the insertion process in an interference fit pin-plate connection.…”