Photoelastic effects in Nd:YAG rod and slab lasers

Lu, Qiaoyin; Wittrock, Ulrich; Dong, Shalei

doi:10.1016/0030-3992(95)93621-w

Cited by 31 publications

(10 citation statements)

References 5 publications

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“…where the second-rank tensor B 0, ij represents the freeof-stress indicatrix tensor, and ΔB ij represents the indicatrix changes produced due to induced stress, which can also be expressed as [7],…”

Section: Stress Post-processing and Mathematical Methodologymentioning

confidence: 99%

Solderjet bumping packaging technique optimization for the miniaturization of laser devices

Ribes-Pleguezuelo

Septriani

Zhang

et al. 2017

J. Eur. Opt. Soc.-Rapid Publ.

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Background: Low-stress soldering techniques can guarantee a minimized input of thermal energy allowing for the design and later assembly of more robust and miniaturized optical devices. However, in order to build miniaturized optical devices, these small-induced stresses produced by soldering techniques have to be investigated to guarantee that the stress-induced birefringence effects do not alter the device optical properties and requirements. Methods: An analytical method that relates the stress-induced birefringence of laser components with their corresponding lasing capabilities has been compared to the real induced-stress results created in components packaged using solderjet technology. The main goal was to optimize the optical component packaging by using this low induced-stress soldering technique. The optimization was carried out by assessing components miniaturization while still assuring high robustness of the bond strength without creating a beam depolarization ratio of more than 1%. Results: The outcome of the study showed the possibility of assembling laser optical components down to sizes of around 300 μm, creating a bond strength of 5 N and higher, and a depolarization ratio much lower than the proposed target of 1%. Conclusions: Our results in terms of induced stress agreed with the finite element method result, which would imply correct post-processing laser simulations. This suggested that the solderjet bumping technique could robustly join components down to the laser emission beam size without strongly affecting the optical properties.

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Section: Stress Post-processing and Mathematical Methodologymentioning

confidence: 99%

Solderjet bumping packaging technique optimization for the miniaturization of laser devices

Ribes-Pleguezuelo

Septriani

Zhang

et al. 2017

J. Eur. Opt. Soc.-Rapid Publ.

View full text Add to dashboard Cite

show abstract

“…While the birefringence would not depolarize a laser mode propagating along the z axis, it could depolarize a beam propagating along a zigzag path in the yz plane. 4,6 However, this depolarization can be prevented by cutting the slab from the boule with the appropriate crystallographic orientation. 6 Real slabs are not infinitely high and long, nor are they uniformly pumped or uniformly face cooled.…”

Section: Introductionmentioning

confidence: 99%

“…4,6 However, this depolarization can be prevented by cutting the slab from the boule with the appropriate crystallographic orientation. 6 Real slabs are not infinitely high and long, nor are they uniformly pumped or uniformly face cooled. Thermally induced shear stresses thus occur, causing additional birefringence that depolarizes the laser mode.…”

Section: Introductionmentioning

confidence: 99%

“…Thermally induced shear stresses thus occur, causing additional birefringence that depolarizes the laser mode. 6 This is particularly relevant for the high gain cw laser heads that are necessary for use with unstable resonators. 1,3,7 This paper will investigate thermally induced birefringence in practical crystalline Nd:YAG slabs.…”

Section: Introductionmentioning

confidence: 99%

“…We shall begin by briefly reviewing the preferred orientation of the zigzag slab within the Nd:YAG boule in Section 2, and the photoelastic effects in crystalline Nd:YAG slabs 6 in Section 3. The thermally induced birefringence is calculated using the dielectric impermeability tensor and the temperature and stress distributions predicted by the FEM.…”

Section: Introductionmentioning

confidence: 99%

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