Photodiode Packaging Technique Using Ball Lens and Offset Parabolic Mirror

Sakai, Kiyohide; Kawano, M.; Aruga, Hiroshi; Takagi, Shinichi; Kaneko, S.; Suzuki, Jun–ichi; Negishi, M.; Kondoh, Y.; Fukuda, K.

doi:10.1109/jlt.2009.2020068

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Effect Of Connecting Ways On Module Performance1

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“…[54]. Many works have been conducted into the behavior of wire-bonding [55,56] and flip-chip [57,58] . Compared with wire-bonding technology, flip-chip technology generally has a superior performance in terms of small solder bumps and less inductive parasitics.…”

Section: Effect Of Connecting Ways On Module Performancementioning

confidence: 99%

High-speed photodetectors in optical communication system

Zhao

Liu

et al. 2017

J. Semicond.

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This paper presents a review and discussion for high-speed photodetectors and their applications on optical communications and microwave photonics. A detailed and comprehensive demonstration of high-speed photodetectors from development history, research hotspots to packaging technologies is provided to the best of our knowledge. A few typical applications based on photodetectors are also illustrated, such as free-space optical communications, radio over fiber and millimeter terahertz signal generation systems.

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