1987
DOI: 10.1002/apmc.1987.051530105
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Photoconductive properties of cadmium sulfide encapsulated in polymers

Abstract: Cadmium sulfide (CdS) was encapsulated in poly(methylmethacrylate), poly(styrene) or poly(vinylcarbazole) by the encapsulating polymerization process, and its photoconductivity was investigated. As result, it was observed a remarkable light‐sensitive effect. The light sensitive effect of CdS encapsulated in poly(methylmethacrylate) (C‐MMA‐CdS) is particularly marked and depends largely on the encapsulation rate. The photosensitive mechanisms of encapsulated cadmium sulfide (C‐CdS), CdS material, and CdS/polyme… Show more

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Cited by 6 publications
(2 citation statements)
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“…The encapsulation of inorganic particles of submicron size has been investigated using a number of different polymerization methods, including emulsion polymerization,7–22 interfacial polymerization,23–25 suspension polymerization,26–28 and more recently, miniemulsion polymerization 29. Inorganic particles have included TiO 2 , carbon black, magnetite, quartz powder, SiO 2 , CdS, BaSO 4 , and CaCO 3 , while polymers have included polystyrene, poly(vinyl acetate), poly(butyl acrylate), and poly(methyl methacrylate).…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The encapsulation of inorganic particles of submicron size has been investigated using a number of different polymerization methods, including emulsion polymerization,7–22 interfacial polymerization,23–25 suspension polymerization,26–28 and more recently, miniemulsion polymerization 29. Inorganic particles have included TiO 2 , carbon black, magnetite, quartz powder, SiO 2 , CdS, BaSO 4 , and CaCO 3 , while polymers have included polystyrene, poly(vinyl acetate), poly(butyl acrylate), and poly(methyl methacrylate).…”
Section: Introductionmentioning
confidence: 99%
“…Inorganic particles have included TiO 2 , carbon black, magnetite, quartz powder, SiO 2 , CdS, BaSO 4 , and CaCO 3 , while polymers have included polystyrene, poly(vinyl acetate), poly(butyl acrylate), and poly(methyl methacrylate). Both conventional and emulsifier‐free emulsion polymerizations13–22 have been carried out. The major obstacles in successfully applying emulsion polymerization as an encapsulation method are attributed to the complexity of the particle nucleation mechanism (micellar, homogeneous) and the difficulties in controlling the dispersion stability of the inorganic particles in the aqueous phase prior to and during polymerization.…”
Section: Introductionmentioning
confidence: 99%