2008
DOI: 10.1039/b718888a
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Photochemical fabrication of three-dimensional micro- and nano-structured surfaces from a C60 monoadduct

Abstract: Exposure of Langmuir-Blodgett (LB) films of a C 60 adduct supported on silicon wafers to UV light leads to cross-linking of the C 60 moieties, which are resistant to removal by solvent exposure, whereas unexposed moieties are readily removed. This process provides a convenient and simple route for the fabrication of highly conjugated surface-attached structures, with dimensions ranging from micrometres (using masks) to a few tens of nanometres using light emitted from a scanning near-field optical microscope (… Show more

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Cited by 8 publications
(7 citation statements)
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References 54 publications
(43 reference statements)
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“…Currently, the electrical properties of such wires are being determined. This methodology has recently been extended to C 60 [89]. Addition of a hydrophilic adduct to the fullerenes enabled their formation into bilayers using LangmuirSchaeffer techniques.…”
Section: Uv Rch 3 Rcoohmentioning
confidence: 99%
See 1 more Smart Citation
“…Currently, the electrical properties of such wires are being determined. This methodology has recently been extended to C 60 [89]. Addition of a hydrophilic adduct to the fullerenes enabled their formation into bilayers using LangmuirSchaeffer techniques.…”
Section: Uv Rch 3 Rcoohmentioning
confidence: 99%
“…Right: tapping mode AFM image of 70 nm "wires" formed by photochemical cross-linking of C 60 by near-field exposure. Reproduced from[89].…”
mentioning
confidence: 98%
“…Films of buckminsterfullere, C 60 , have been patterned in a very similar way. 89 Introduction of a hydrophyllic adduct (consisting of two oligo(ethylene glycol) chains) assists with Langmuir-Schaeffer film formation, enabling transfer to a silicon wafer in an organised structure, following which SNP can be used to initiate photochemical cross-linking to yield patterns of wires, that may be imaged by AFM following rinsing to remove unmodified particles (Fig. 9(b)).…”
Section: Other Resist Systemsmentioning
confidence: 99%
“…One method to create these patterns is by exposure of thiol-stabilised gold NPs supported on silicon wafers to UV light leading to oxidation of the thiol and coagulation of the NPs [20], or photo-crosslinking of C60 derivatives [21], forming dense structures that are resistant to removal by organic solvents. Methods exist to further derivatise gold surfaces, such as those formed, with oligonucleotide sequences [11,22,23].…”
Section: Introductionmentioning
confidence: 99%