1993
DOI: 10.2494/photopolymer.6.393
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Photoablative behavior of polyimide irradiated by several short pulse lasers.

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Cited by 6 publications
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“…Laser processing of engineering plastics has been intensively studied using short pulse lasers since first demonstration of photoetching of engineering plastics by an excimer laser in 1983 [12,13]. Ito et al studied photo-ablative behavior of polyimide by nanosecond lasers with different wavelengths, demonstrating that the high absorption coefficient at a short wavelength of a laser beam makes high-quality holes without thermal damage [14]. Kumagai et al investigated laser ablation of polymer films of polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, and polyimide (PI) through multiphoton absorption using a femtosecond high-peak-power Ti:sapphire laser at 798 nm [15].…”
Section: Introductionmentioning
confidence: 99%
“…Laser processing of engineering plastics has been intensively studied using short pulse lasers since first demonstration of photoetching of engineering plastics by an excimer laser in 1983 [12,13]. Ito et al studied photo-ablative behavior of polyimide by nanosecond lasers with different wavelengths, demonstrating that the high absorption coefficient at a short wavelength of a laser beam makes high-quality holes without thermal damage [14]. Kumagai et al investigated laser ablation of polymer films of polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, and polyimide (PI) through multiphoton absorption using a femtosecond high-peak-power Ti:sapphire laser at 798 nm [15].…”
Section: Introductionmentioning
confidence: 99%