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Final Technical Report
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TITLE AND SUBTITLELaser Applications in Microelectronic and Optoelectronic Manufacturing V 5a. CONTRACT NUMBER 5b. GRANT NUMBER F49620-00-1-0135 5c. PROGRAM ELEMENT NUMBER
AUTHOR(S)Helvajian, Henry Sugioka, Koji Dubowski, Jan J. Gower, Malcom C.5d. PROJECT NUMBER 5e. TASK NUMBER 5f. WORK UNIT NUMBER
PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES)Society of Photo-Optical Instrumentation Engineers PO Box 10 (SPIE) fielUngham. WA 98227-0010
PERFORMING ORGANIZATION REPORT NUMBERVolume 3933
SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESS(ES)Air
SPONSOR/MONITOR'S ACRONYM(S)AFOSR/NE
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DISTRIBUTION AVAILABILITY STATEMENTApproved for Public Release
SUPPLEMENTARY NOTESISBN 0-8194-3550-3
ABSTRACTThis proceedings contains papers on the following topics: fundamental processes of laser material interaction phenomenon, laser material processing techniques, pulsed-laser deposition, and laser microengineering. The latter topic was added to LAMOM V and reflects the srong growth in the application of lasers to micromachining, 3D fabrication, and microtexturing operations.
SUBJECT TERMS
IntroductionThe laser is currently in its fourth decade of development and is emerging as the tool of choice for material processing in the 21 st century. Laser processing is by nature an environmentally "clean" and in-situ processing approach. It has a very large dynamic range of processing size from a scale that can exceed the wavelength of light to dimensions measured in many square meters. It has also been shown to process a variety of materials, from delicate matter of biological origin to diamond, the hardest material known. Therefore, one can defend the notion that the laser, as a material processing tool, has advanced to a relatively mature stage to merit an annual review of its applicability to various material processing tasks. The Laser Applications in Microelectronics and Optoelectronics Manufacturing (LAMOM) conference series is an attempt to provide a common forum for both scientific and engineering exchange to address aspects of processing materials with lase...