“…Atmospheric-pressure chemical vapor deposition (CVD) is a method of depositing high-quality metal oxide films onto various substrates at atmospheric pressure and without requiring a vacuum system (Saitoh, Okada, & Ohshio, 2002;Saitoh, Takano, Kawaguchi, Washio, Ohshio, & Akasaka, 2009;Akasaka et al, 2013;Sugata et al, 2003;Satoh et al, 2002;Satou et al, 1999;Saitoh, Fukada, & Ohshio, 2003;Tokita, Tanaka, & Ohshio, 2003;Tokita, Tanaka, & Saitoh, 2000). Further, the atmospheric-pressure CVD apparatus is inexpensive and can be used to deposit uniform, homogeneous, dense films showing high coverage, tunable chemical compositions and morphologies, and no uncoated "hidden areas."…”