1984
DOI: 10.1016/0038-1098(84)90671-9
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Photo-induced degradation of a-Si: H diodes with an nin structure

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1984
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Cited by 31 publications
(3 citation statements)
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“…The plasma enhanced chemical-vapor-deposition (PECVD) method is employed due to its advantage of generating uniform films over a large scale substrate [3]. Nonetheless, the indispensable high-rate deposition process for the reduction of manufacturing costs poses a serious problem in the actualization of a-Si:H films, namely photo-induced degradation (PID) [4,5]. PID will contribute to a serious deterioration of photoelectric performance, especially the conversion efficiency of a-Si:H based thin films [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…The plasma enhanced chemical-vapor-deposition (PECVD) method is employed due to its advantage of generating uniform films over a large scale substrate [3]. Nonetheless, the indispensable high-rate deposition process for the reduction of manufacturing costs poses a serious problem in the actualization of a-Si:H films, namely photo-induced degradation (PID) [4,5]. PID will contribute to a serious deterioration of photoelectric performance, especially the conversion efficiency of a-Si:H based thin films [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…A considerably reduced resistance of the a-Si:H layers by up to a factor of two was found due to the manufacturing conditions of the module [10]. Finally, the partial discharge was measured up to 10 kV in steps of 500 V. A considerable reduction of the partial discharge was observed compared to standard modules (Fig.…”
Section: Partial Discharge Of Modules With A-si:h Coated Substratesmentioning
confidence: 98%
“…Excess defect concentration in a-Si:H can also be created by charge injection [den Boer et al 1984, Pfleiderer et al 1984, or by bombardment with keV electrons [Wagner et al 1987]. In all cases, the state of the sample after degradation is metastable, and state A of minimum defect density is achieved after annealing at sufficiently high temperature.…”
Section: Introductionmentioning
confidence: 99%