1991
DOI: 10.1049/el:19911245
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Photo/EB hybrid exposure process for T-shaped gate superlow-noise HEMTs

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Cited by 31 publications
(7 citation statements)
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“…A Si-planar doping layer with sheet carrier concentration of 5x1012 cm-2 was inserted into the AlGaAs layer in order to obtain high transconductance. The 0.15 pm T-shaped gate electrode is defined using electroin beam lithography and a double kyer resist process [6]. 'The dual gate electrode could be fabricated using the same process as a single gate one.…”
Section: Device and Mmic Fabricationmentioning
confidence: 99%
“…A Si-planar doping layer with sheet carrier concentration of 5x1012 cm-2 was inserted into the AlGaAs layer in order to obtain high transconductance. The 0.15 pm T-shaped gate electrode is defined using electroin beam lithography and a double kyer resist process [6]. 'The dual gate electrode could be fabricated using the same process as a single gate one.…”
Section: Device and Mmic Fabricationmentioning
confidence: 99%
“…The gate length and width are 0.2 and 80 m, respectively. The gate electrode is defined by a photo/electron beam (EB) hybrid exposure system with double-layer resist layers [14]. This process has excellent wafer throughput because it utilizes a step-and-repeat exposure procedure instead of EB lithography in fabricating the wide head of the T-shaped gate structure.…”
mentioning
confidence: 99%
“…In delineating the T-shaped gate electrode, a double layer resist process has been adopted [4]. The gate length was 0.1.5pm.…”
Section: Processmentioning
confidence: 99%