Phenylethynyl terminated oligoimides derived from 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride and their adhesive properties

Sun, Hongjie; Huo, Haitao; Nie, Hao; Shen, Yang; Fan, Lin

doi:10.1016/j.eurpolymj.2009.01.004

Cited by 36 publications

(18 citation statements)

References 28 publications

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“…It was found that the curing reaction of phenylethynylcarbonyl terminated imide compound occurred, and then the alkene groups or aromatic groups (the absorptions around 1600 cm -1 ) might be generated by the curing reaction. Based on the investigations on the thermal curing of phenylethynyl terminated imide oligomers it has been suggested that a polyene initially began to form in the curing reaction, which then participated in more complex reactions to yield crosslinked aromatic structures and condensed polycyclic unsaturated structures [9][10][11][12][13]. Figure 10 shows the TGA curves of the cured thermosetting resin from phenylethynylcarbonyl terminated imide compound (PECI-APB) and that from o-cresol novolac type epoxy resin (EP).…”

Section: Curing Reaction Of Phenylethynylcarbonyl Terminated Imide Comentioning

confidence: 99%

Synthesis and characterization of phenylethynylcarbonyl terminated novel thermosetting imide compound

Kimura¹,

Ohtsuka²,

Matsumoto³

et al. 2013

Express Polym. Lett.

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Abstract. Phenylethynyl terminated novel imide compound based on 1,3-bis(3-aminophenoxy)benzene (APB) and phenylethynyl trimellitic anhydride (PETA) were prepared. The curing behavior of phenylethynyl terminated imide compound was investigated by differential scanning calorimetry and Fourier transform infrared spectrometry. The curing reaction of phenylethynylcarbonyl end group completed at 220°C, and proceeded much faster than that of phenylethynyl end group. Glass transition temperature of the thermosetting resin from phenylethynylcarbonyl terminated novel imide compound determined by dynamic mechanical analysis was almost the same as that of o-cresolnovolac type epoxy resin. In addition, the thermosetting resin from phenylethynylcarbonyl terminated novel imide compound exhibited excellent thermal and dimensional stabilities. These excellent properties of these phenylethynyl terminated imide compound might be due to the incorporation of alkene group or aromatic ring substitutes in the backbones, which might enhance the chain interaction (molecular packing) and reduce the molecular chain mobility.

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Section: Curing Reaction Of Phenylethynylcarbonyl Terminated Imide Comentioning

confidence: 99%

Synthesis and characterization of phenylethynylcarbonyl terminated novel thermosetting imide compound

Kimura¹,

Ohtsuka²,

Matsumoto³

et al. 2013

Express Polym. Lett.

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“…After curing, the PIs showed appropriate chain cross-linkability and extendibility, leading to excellent mechanical properties with improved toughness and good thermal stability. [12][13][14][15] Among the workers who have been working on phenylethynyl-terminated imide oligomers since 1980s, researchers in NASA Langley Research Center successfully prepared significant phenylethynyl terminated imide (PETI)-5 as the adhesive and composite matrix resin, which derived from 3,3 0 ,4,4 0 -biphenyltetracarboxylic dianhydride (s-BPDA), 1,3-bis(3-aminophenoxy)benzene, and 3,4 0 -oxydianiline with calculated molecular weight of 5000 g mol À1 . 16,17 In spite of good combination of high fracture toughness, thermo-oxidative stability, and good processability, PETI-5 exhibited a relatively low glass transition temperature (T g ) of 270 C and high melt viscosity (6000 Pa s) even at a temperature as high as 370 C, resulting in limited melt processability.…”

Section: Introductionmentioning

confidence: 98%

Phenylethynyl-terminated imide oligomers derived from thioetherdiphthalic anhydride isomers with decreased melt viscosities

Sun

Wang

et al. 2016

High Performance Polymers

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A series of oligomers based on the mixture of thioetherdiphthalic anhydride isomers and 4,4 0 -oxydianiline with 4-phenylethynylphthalic anhydride as reactive endcapping reagent were prepared. The calculated molecular weights were in the range of 1150-5070 g mol À1 with different degrees of polymerization (n ¼ 1, 3, 5, 7, and 9). The effect of molecular weight of the aromatic oligomers on their processability and solubility as well as the thermal and mechanical properties of the thermal-cured polyimides (PIs) was systematically investigated. The typical oligomer (Oligo-1) could be melted at temperatures of 289-334 C to yield stable molten fluid with melt viscosity below 1.0 Pa s. The melt viscosity of the oligomers increased with the increasing molecular weight. After thermally curing at 370 C, the thermoset PIs exhibited good thermal properties. The glass transition temperatures of oligomers measured by differential scanning calorimetry were in the range of 286-326 C, and the temperature of 5% weight loss was higher than 524 C. The cured films also showed good mechanical properties with tensile strength above 72 MPa and modulus more than 2.5 GPa.

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“…Because of their outstanding combinations of mechanical and thermal properties, PIs occupy a unique position as hightemperature structure adhesives (7)(8)(9). PIs in the form of poly(amic acid) (PAA) solutions, PI solutions and PI films can be applied in adhesive joints (9)(10)(11). The PI film adhesives have received considerable attention because of their advantages in large-area bonding and ease of use.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Meltable Aromatic Polyimides and Their Adhesive Properties

Huo

Sun

Song

et al. 2011

Journal of Macromolecular Science, Part A

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A series of molecular-weight-controlled aromatic polyimides based on 4,4 -oxydiphthalic anhydride (ODPA), 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (6FAPB) and 3,3 -diaminodiphenylsulfone (3,3 -DDS) were synthesized in the presence of phthalic anhydride (PA) as an end-capping agent. The effect of molecular weight on the solubility, melt viscosity, thermal and mechanical properties of the polyimides was investigated. Experimental results demonstrated that the polyimides exhibit good solubility in most polar aprotic solvents and in some common organic solvents, such as DMSO and THF. Homogeneous and stable polyimide solutions with solid contents as high as 40-45 wt% were prepared. High-quality polyimide films were obtained by casting the polyimide solutions onto glass plates and baking them at a relatively low temperature. The polyimide films exhibited outstanding thermal and mechanical properties. The rheological behavior of the polyimides depends on their molecular weight. The adhesive properties of polyimide films bonded to stainless steel at different temperatures were evaluated by the lap shear strength (LSS) test. The polyimides with moderate molecular weight exhibited better adhesive properties. The LSS of polyimide films at ambient and elevated temperatures increased with increasing bonding temperature, which is attributed to the better flow and wetting of the polymer melts during the bonding process.

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Phenylethynyl terminated oligoimides derived from 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride and their adhesive properties

Cited by 36 publications

References 28 publications

Synthesis and characterization of phenylethynylcarbonyl terminated novel thermosetting imide compound

Synthesis and characterization of phenylethynylcarbonyl terminated novel thermosetting imide compound

Phenylethynyl-terminated imide oligomers derived from thioetherdiphthalic anhydride isomers with decreased melt viscosities

Preparation of Meltable Aromatic Polyimides and Their Adhesive Properties

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