2020
DOI: 10.1016/j.coco.2020.100433
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Phenol formaldehyde resin derived carbon-MCMB composite foams for electromagnetic interference shielding and thermal management applications

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Cited by 25 publications
(22 citation statements)
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“…Polyamide A062 has equivalent weight per H active of 110. The density and viscosity of polyamide A062 at 25 °C were 0.96 g/cm 3 and 35-45 Pas, respectively. AB provided from HmbG Chemicals Malaysia was white crystalline powder used as the blowing agent and has density of 1.58 g/cm 3 .…”
Section: Methodsmentioning
confidence: 96%
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“…Polyamide A062 has equivalent weight per H active of 110. The density and viscosity of polyamide A062 at 25 °C were 0.96 g/cm 3 and 35-45 Pas, respectively. AB provided from HmbG Chemicals Malaysia was white crystalline powder used as the blowing agent and has density of 1.58 g/cm 3 .…”
Section: Methodsmentioning
confidence: 96%
“…The density and viscosity of polyamide A062 at 25 °C were 0.96 g/cm 3 and 35-45 Pas, respectively. AB provided from HmbG Chemicals Malaysia was white crystalline powder used as the blowing agent and has density of 1.58 g/cm 3 . Corn oil was purchased from Yee Lee Corporation Sdn.…”
Section: Methodsmentioning
confidence: 96%
See 1 more Smart Citation
“…By constructing 3D conductive networks among the conductive fillers within the polymer matrix, polymer‐based EMI shielding composites with light weight, outstanding conductivity, excellent EMI shielding performances, and outstanding mechanical properties can be prepared with a pretty low loading of conductive fillers. The preparation methods of polymer‐based EMI shielding composites mainly include the template method, freeze‐drying method, hydrothermal method, and foaming method 23–27 …”
Section: Preparation Methods Of Polymer‐based Emi Shielding Materials With 3d Conductive Networkmentioning
confidence: 99%
“…The preparation methods of polymer-based EMI shielding compos-ites mainly include the template method, freeze-drying method, hydrothermal method, and foaming method. [23][24][25][26][27]…”
Section: Preparation Methods Of Polymer-based Emi Shielding Materials With 3d Conductive Networkmentioning
confidence: 99%