Phase Identification of Cu-In Alloys with 45 and 41.25 at.% In Compositions

Abstract

In this work, the thermal stability of Cu-In alloys with 45.0 and 41.2 at.% In nominal compositions was investigated by differential scanning calorimetry (DSC), scanning electron microscopy, wavelength dispersive spectroscopy, and in-situ synchrotron x-ray powder diffraction (S-PXRD) over a temperature range from 25 up to 400 °C. The studied samples are mainly composed of a Cu 11 In 9 phase together with minor amounts of the B phase (based on the NiAs-Ni 2 In type structure) and, in one of the samples, with a minor amount of pure In. No evidence of the Cu 10 In 7 (41.2 at.% In) phase was detected, not even in the sample with 41.2 at.% In nominal overall composition. The combined use of the S-PXRD and DSC techniques allowed us to identify two phase transitions involving the Cu 11 In 9 phase, one of them corresponding to the g 0 Ð B þ Cu 11 In 9 reaction at T = 290 °C and the other to the peritectic g 0 þ L Ð Cu 11 In 9 reaction at T = 311 °C.

Generation of Cu–In alloy surfaces from CuInO2as selective catalytic sites for CO2electroreduction

“…For the sample aer electrolysis, major peaks assigned to metallic Cu 11 In 9 , Cu 7 In 3 and Cu were observed, in addition to the peaks associated with the carbon substrate, consistent with the phase diagram of the Cu-In system. 43 It was conrmed that the CuInO 2 phase was reduced to form the metallic phase. The SEM image of the as-prepared sample in Fig.…”

“…On one hand, the nature of the second metal or metal oxide situated in the vicinity of Cu appears to be paramount in the context of the CO2 reduction process. 43 It was confirmed that the CuInO2 phase was reduced to form the metallic phase. [39][40][41] Thus, the discrete nature of each component in the Cu-based system influenced the selectivity of the products from aqueous CO2 under identical conditions.…”

Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging

“…31 Besides, the melting point of the IMC, i.e., Cu 11 In 9 (about 310 °C), is much higher than that of indium (156 °C), which means a much higher working temperature of the thermal interface materials. 32 Here, we tested the thermal conductivities of the porous material at various temperatures to evaluate its viability in different scenarios. It can be seen from Figure 2h that the thermal conductivity of porous copper slightly decreases from 43.0 W m −1 K −1 at 25 °C to 39.7 W m −1 K −1 at 225 °C, which suffers from higher-temperature-induced stronger phonon scattering.…”

A review on PV cells and nanocomposite-coated PV systems

“…The a‐Si solar cells are of low efficiency but proved to be more environmentally friendly PV cells. This uses less silicon and also does not contain the aluminum frame, but on the flip side, the efficiency is between 6% to 12% and less popular as they are harder to replace . Amorphous alloys of silicon and carbon (amorphous silicon carbide, also hydrogenated, a‐Si1 − xCx:H) are an interesting variant.…”