Phase Equilibria of Sn-Co-Cu Ternary System

Hsu, Chiou-Ting; Chen, Sinn-wen; Chen, Chih‐Ming; Huang, Yaohua

doi:10.1007/s11661-012-1192-7

Cited by 16 publications

(4 citation statements)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…3, where SOF is the site occupation fraction [21]. The crystal structure of Co 3 Sn 2 compound at high temperature is β-Co 3 Sn 2 , while it becomes the α-Co 3 Sn 2 when the temperature drops below 570 K. According to the previous results revealed by Chen et al [13], it can be deduced from the XRD patterns that the crystal structure of Co 3 Sn 2 compound exists in this rapidly solidified ternary alloy specimen is the high temperature modification. For the other two minor (Co) and Cu 41 Sn 11 phases, their volume fractions both show a decreasing tendency with the increase of droplet diameter.…”

Section: Heat Transfer Analysis Of Alloy Dropletmentioning

confidence: 99%

“…The Co 3 Sn 2 intermetallic compound (IMC) has been aroused researchers' attention in recent years [12][13][14][15]. It has an ordered hexagonal NiAs-type (P6 3 /mmc) crystal structure above 570 K and transforms into disorder orthorhombic Ni 3 Sn 2 -type (Pnma) structure at lower temperatures [16].…”

Section: Introductionmentioning

confidence: 99%

“…It has an ordered hexagonal NiAs-type (P6 3 /mmc) crystal structure above 570 K and transforms into disorder orthorhombic Ni 3 Sn 2 -type (Pnma) structure at lower temperatures [16]. The melt undercooling and composition of the alloy are two significant factors that affect the formation of unusual dendrite growth morphology of Co 3 Sn 2 IMC [12][13][14]. Meanwhile, prior studies have shown that Co 3 Sn 2 intermetallic compound precipitates from the melt as the primary phase and displays a high volume fraction once Sn content exceeds 30 at% in the ternary (Co 0.5 Cu 0.5 ) (100−x) Sn x alloys during near-equilibrium solidification [15].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Primary dendrite growth of Co3Sn2 intermetallic compound in rapidly solidified ternary Co35Cu35Sn30 alloy

et al. 2018

View full text Add to dashboard Cite

The rapid solidification of ternary Co 35 Cu 35 Sn 30 alloy droplets with 20-785 µm diameter was realized by drop tube technique, aiming to investigate the dendrite growth mechanism of primary Co 3 Sn 2 intermetallic compound at high cooling rate. As alloy droplet diameter decreases, the surface segregation occurs prior to the solidification process with an increased probability, and the segregation shell becomes more apparent. The dendrite growth of primary Co 3 Sn 2 compound dominates the droplet solidification process, which evolves from equiaxed dendrite to spherical grain and is accompanied by remarkable grain refinement with the decrease of droplet diameter. Meanwhile, a peculiar zone near the droplet surface in which the primary Co 3 Sn 2 compound grows directionally is observed. This directional structure becomes more evident as droplet diameter decreases, which is attributed to the temperature gradient along the radial direction inside droplet. In each alloy droplet, owing to the increased cooling rate from the center to the surface, the grain size decreases accordingly.

show abstract

Section: Heat Transfer Analysis Of Alloy Dropletmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Primary dendrite growth of Co3Sn2 intermetallic compound in rapidly solidified ternary Co35Cu35Sn30 alloy

et al. 2018

View full text Add to dashboard Cite

show abstract

“…As a result of interaction with tin at the sintering temperature, all particles of copper were dissolved in the liquid phase. At 820-1100 °С Co-Sn-Cu material consisted of cobalt particles and the liquid phase [11].…”

mentioning

confidence: 99%

Interaction of Components of Co-Sn and Co-Sn-Cu Powder Materials in Liquid Phase Sintering

Sokolov

Ozolin

Svistun

et al. 2019

MSF

View full text Add to dashboard Cite

The interaction of components and structure formation were studied in liquid phase sintering of Co-Sn and Co-Sn-Cu powder materials. The powders of commercially pure metals were mixed with an organic binder and applied on the steel substrate. Sintering was performed under vacuum at temperatures of 820 and 1100 °C. The structure of sintered alloys was investigated by X-ray diffractometry and electron probe microanalysis, and microhardness (HV0.01) of the structural components was measured. It has been found that the nature of interaction of the liquid tin with the solid phase at the initial stage of sintering affects the formation of structure and porosity of Co-Sn and Co-Sn-Cu alloys considerably. In Co-Sn alloys, diffusion of tin into cobalt particles leads to the formation of intermetallic compounds, which hinders spreading of the liquid phase. This results in a porous defect structure formed in Co-Sn alloys. In Co-Sn-Cu alloys, at the initial stage of sintering the liquid phase enriched with copper is formed that wets the cobalt particles and contributes to their regrouping. As a result of this, materials with minor porosity are formed.

show abstract

Study of the Structure and Hardness of Alloys of the Sn – Cu – Co System Used as Diamond Abrasive Tool Binders

2017

View full text Add to dashboard Cite

Phase Equilibria of Sn-Co-Cu Ternary System

Cited by 16 publications

References 14 publications

Primary dendrite growth of Co3Sn2 intermetallic compound in rapidly solidified ternary Co35Cu35Sn30 alloy

Primary dendrite growth of Co3Sn2 intermetallic compound in rapidly solidified ternary Co35Cu35Sn30 alloy

Interaction of Components of Co-Sn and Co-Sn-Cu Powder Materials in Liquid Phase Sintering

Study of the Structure and Hardness of Alloys of the Sn – Cu – Co System Used as Diamond Abrasive Tool Binders

Contact Info

Product

Resources

About