Perspective Optical and Electronic Interconnects of Integrated Circuit Elements

Abstract

The recent results of the investigations performed in the research units of the Department of Micro- and Nanoelectronics of Belarusian State University of Informatics and Radioelectronics in the field of the development of perspective optical and electronic intra-chip and inter-chip interconnections of silicon integrated circuits are summarized. Examples of the use of nanostructured materials for the proposed light sources and detectors (Si) as well as light guides (Al2O3/TiO2) integrated with monocrystalline silicon are presented. The strategy of an application of inter-chip interposers for optical and electronic connections in bulk (2.5D and 3D) packages of integrated circuits was promoted and tested. Novel materials and structures promising for light sources, optically transparent electrical conductors and protectors against microwave electromagnetic radiation are demonstrated.