Performances of screen-printing silver thick films: Rheology, morphology, mechanical and electronic properties

Jiang, Jung-Shiun; Liang, Jau-En; Yi, Han; Chen, Shuhua; Hua, Chi C.

doi:10.1016/j.matchemphys.2016.03.032

Cited by 18 publications

(3 citation statements)

References 24 publications

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“…The direct integration of passive components is well established in conventional thickfilm technology based on silver paste metallization used in a wide range of electronic applications. Silver pastes are mainly determined for firing in an oxidative atmosphere, which is usually common air [7]. However, silver metallization cannot meet power electronic substrates' requirements because it is complicated and expensive to ensure the proper thickness of conductive traces for high current passing.…”

Section: Introductionmentioning

confidence: 99%

Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications

2021

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This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate manufacturing instead of conventional metallization techniques. Two types of copper–nickel inks were prepared and deposited by Aerosol Jet technology. The first type of ink was based on copper and nickel nanoparticles with a ratio of 75:25, and the second type of ink consisted of copper–nickel alloy nanoparticles with a ratio of 55:45. The characterization of electrical parameters, microstructure, thermal analysis of prepared inks and study of the influence of copper–nickel content on electrical parameters are described in this paper. It was verified that ink with a copper–nickel ratio of 55:45 (based on constantan nanoparticles) is more appropriate for the production of resistors due to low sheet resistance ~1 Ω/square and low temperature coefficient of resistance ±100·10−6 K−1 values. Copper–nickel inks can be fired in a protective nitrogen atmosphere, which ensures compatibility with copper films. The compatibility of copper–nickel and copper films enables the production of integrated resistors directly on ceramics substrates of power electronics modules made by TPC technology.

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Section: Introductionmentioning

confidence: 99%

Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications

2021

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“…For the abovementioned reasons, research on printed electronic technologies [e.g., inkjet printing (Leenen et al 2009;Arias et al 2010) and screen printing (Faddoul et al 2012;Jiang et al 2016)] to directly produce a conductive pattern onto a flexible plastic film is being considerably performed. Inkjet printing is one of the most commonly used techniques for producing high-resolution conductive patterns because of its simplicity and minimal waste of materials (Kawase et al 2003;Kang et al 2012).…”

Section: Introductionmentioning

confidence: 99%

Fabrication of high-resolution conductive patterns on a thermally imprinted polyetherimide film by the capillary flow of conductive ink

et al. 2020

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We developed herein a simple and economical high-resolution wiring process on a plastic substrate. High-resolution conductive patterns on the PEI film was fabricated by utilizing the thermal imprint technology and the capillary flow of the conductive ink. An amorphous thermoplastic polyetherimide (PEI) film was thermally imprinted with a metal mold having line (8 lm)/space (12 lm) structures. The effects of the imprint temperature, melting time, and imprint pressure on the PEI film transferability were investigated. A higher replication ratio was obtained when the molding temperature was higher, the melting time was longer, the imprint pressure was higher, and the mold structure height was lower. The mold structures were almost perfectly transferred on the PEI film surface at a molding temperature of 285°C, a melting time of 3.0 min, and a molding pressure of 1.0 MPa. Two different wiring processes, namely, spin coating and capillary flowing of Ag ink onto the imprinted PEI film, were conducted. For the spin-coating wiring process, the Ag ink existed not only inside the grooves but also on the convex area as the residual layer, regardless of rotational speed and time. For the capillary flowing wiring process, when the Ag ink contacted the edge of the imprinted pattern on the PEI film, it spontaneously flowed toward the wiring direction. Only the concave grooves were selectively filled with Ag ink, and the residual layer was not observed. The fabricated wiring conformed to Ohm's law, with an electric resistivity of 42 9 10 -8 X m.

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“…Cellulose and its derivatives, such as ethylcellulose (EC), are conventionally important materials for a wide range of applications in cosmetics, , pharmaceutics, − and the food industry. − Currently, environmentally and economically favorable wet-processing technologies make almost ubiquitous use of EC as the polymer binder in a broad variety of functional pastes consisting of metal − or ceramic − powders for the fabrication of electronics and energy-storage devices. A deeper understanding of the inherent properties of dilute EC solutions is crucial to help guide the current and emerging applications of EC.…”

Section: Introductionmentioning

confidence: 99%

Ethylcellulose Colloids Incubated in Dilute Solution

Lai

Jiang

et al. 2017

J. Phys. Chem. B

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This study revealed, for the first time, that dilute solutions made of a representative series of commercial ethylcellulose (EC; molecular weights 77-305 kDa, provided by the manufacturer) and four distinct organic solvents (α-terpineol, 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate (TPIB), tetrahydrofuran (THF), and benzene) can be used to foster stabilized, nearly monodisperse, nanoscale (pure) polymer colloid, with no isolated chains present. Using combined light-scattering (dynamic light scattering, static form factor, and Zimm/Berry plots) and intrinsic viscosity (Tanglertpaibul-Rao, Huggins, and Kraemer plots) analyses, the structural features of colloidal EC aggregates, ρ = ⟨R⟩/⟨R⟩ = 0.67-0.83, were first shown to be described rather well by the theory on colloidal spheres (⟨R⟩ and ⟨R⟩ being the mean radius of gyration and the hydrodynamic radius, respectively). An empirical scaling law relating the intrinsic viscosity to the mean colloid size can thus be established: [η] = (1.7 ± 0.2) ×10 ⟨R⟩ ([η] and ⟨R⟩ in units of mL/g and nm, respectively), which may be contrasted with the Zimm model for isolated Gaussian coils, [η] ∼ ⟨R⟩, and the Einstein equation for isolated solid spheres, [η] ∼ ⟨R⟩. Optical microscopy images of thin films cast from different EC solutions clearly revealed the abundance of micron EC agglomerates, contrary to the uniform thin-film morphology produced from a dilute polystyrene solution, which serves as a reference solution composed of isolated chains. These observations point to new features and applications of EC dispersions.

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Performances of screen-printing silver thick films: Rheology, morphology, mechanical and electronic properties

Cited by 18 publications

References 24 publications

Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications

Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications

Fabrication of high-resolution conductive patterns on a thermally imprinted polyetherimide film by the capillary flow of conductive ink

Ethylcellulose Colloids Incubated in Dilute Solution

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