Performance of the novel design thermoelectric cooling system

Abstract

Thermoelectric coolers (TECs) have been used for cooling electrical elements of high dissipating energy to provide a fixed temperature, with the advantages of being reliable, noiseless, tightly packed, with no moving parts as well as no harmful gases. As high performance of TECs is required, developed emerging thermoelectric (TE) materials can be employed to enhance their performance. Hence, this study provides an experimental investigation to study the effect of different operational parameters on the performance of the TE cooling system including the system coefficient of performance (COP) and the rate of heat transfer. The parameters investigated are the applied input power, inlet working fluid velocity, and the arrangement of utilized TECs modules. The used test rig consists of two attached horizontal ducts, and the interface surface between them contains three TE modules, each of power 48 W. The applied input power and the working fluid flow rate range from 16 to 48 W and from 0.0025 to 0.01 L/min, respectively. Results show that the maximum COP occurs at lower values of applied input power. A noticeable enhancement in the COP is found when all TEC modules are in use. A new correlation of the COP of the TEC system is obtained.

Composite pin‐fin heat sink for effective hotspot reduction

“…Since there is an increase in the TDP of processors, it is impossible to cool the processors using traditional cooling methods like forced air cooling. 7 Various alternative methods like heat pipe, 8 vapor chamber, 9 PCM, [10][11][12] thermoelectric cooling, 13,14 liquid cooling, 7 microchannel, [15][16][17] and so on, are used to keep the processors in a safe temperature range. A heat sink is a heat exchanger which removes the heat from any mechanical or electronic component and vents out to a fluid medium, usually liquid coolant or air.…”