Performance of the EUDET-type beam telescopes

Jansen, H.; Spannagel, S.; Behr, J.; Bulgheroni, A.; Claus, G.; Corrin, E.; Cussans, D.; Dreyling-Eschweiler, Jan; Eckstein, D.; Eichhorn, T.; Goffe, Mathieu; Gregor, I. M.; Haas, D.; Muhl, C.; Perrey, H.; Peschke, R.; Roloff, Philipp; Rubinskiy, I.; Winter, M.

doi:10.1140/epjti/s40485-016-0033-2

Cited by 166 publications

(184 citation statements)

References 16 publications

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“…DESY-II is an electron/positron synchrotron delivering beams with energies between 1 GeV and 6 GeV using a double conversion beam. At the beamline 21 the EUDET telescope DATURA [8] and a special set-up, called "three-master", for three ROC4Sens pixel modules (see Fig. 5), which was constructed and built at DESY, was used.…”

Section: First Test Beam Resultsmentioning

confidence: 99%

CMS Pixel detector development for the HL-LHC

Schwandt

2019

Nuclear Instruments and Methods in Physics Research Section A:

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An upgrade program is underway which will bring the luminosity of the LHC up to about 7.5x10 34 cm −2 s −1 in 2027, with the goal of an integrated luminosity of 3000 fb −1 by the end of 2037. This High Luminosity scenario, HL-LHC, will present new challenges of higher data rates and increased radiation hardness for the pixel detector (a non-ionizing fluence of 2x10 16 n eq /cm 2 and an ionizing dose of 10 MGy, is expected on the inner pixel layer for 3000 fb −1 integrated luminosity). To maintain or even improve the performance of the present system, new technologies have to be fully exploited for the so-called Phase-II upgrade. Among them is the future version of front-end chips in 65-nm CMOS by the CERN RD53 Collaboration which supports small pixel sizes of 50x50 or 25x100 µm 2 and lower thresholds (∼ 1000 e − ). For the development of the appropriate planar pixel sensor, CMS has recently launched a submission of n + -p sensors on 6 inch wafers with an active thickness of 150 µm at Hamamatsu. The submission consists of physically thinned, directly bonded and deep diffused wafers with p-stop or p-spray isolation. A variety of sensors with and without biasing scheme is designed to match the different read-out chips (RD53A, ROC4Sens, etc.) and first hybrid modules are assembled at Fraunhofer IZM. In this document, we will present an overview of the Phase II pixel R&D program and report on preliminary results on the HPK submission. AbstractAn upgrade program is underway which will bring the luminosity of the LHC up to about 7.5x10 34 cm −2 s −1 in 2027, with the goal of an integrated luminosity of 3000 fb −1 by the end of 2037. This High Luminosity scenario, HL-LHC, will present new challenges of higher data rates and increased radiation hardness for the pixel detector (a non-ionizing fluence of 2x10 16 n eq /cm 2 and an ionizing dose of 10 MGy, is expected on the inner pixel layer for 3000 fb −1 integrated luminosity). To maintain or even improve the performance of the present system, new technologies have to be fully exploited for the so-called Phase-II upgrade. Among them is the future version of front-end chips in 65-nm CMOS by the CERN RD53 Collaboration which supports small pixel sizes of 50x50 or 25x100 µm 2 and lower thresholds (∼ 1000 e − ). For the development of the appropriate planar pixel sensor, CMS has recently launched a submission of n + -p sensors on 6 inch wafers with an active thickness of 150 µm at Hamamatsu. The submission consists of physically thinned, directly bonded and deep diffused wafers with p-stop or p-spray isolation. A variety of sensors with and without biasing scheme is designed to match the different read-out chips (RD53A, ROC4Sens, etc.) and first hybrid modules are assembled at Fraunhofer IZM. In this document, we will present an overview of the Phase II pixel R&D program and report on preliminary results on the HPK submission.

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Section: First Test Beam Resultsmentioning

confidence: 99%

CMS Pixel detector development for the HL-LHC

Schwandt

2019

Nuclear Instruments and Methods in Physics Research Section A:

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“…The measurements were conducted with the AIDA telescope [5] with spacings of approximately 40 mm. On the measurement plane the intersection position error was found to be roughly 3 µm and the calibrated angle resolution λ · σ reso was approximately 150 µrad.…”

Section: Beam Test Results and Geant4 Simulationsmentioning

confidence: 99%

Radiation length imaging with high resolution telescopes

Stolzenberg¹,

Schwenker²,

Frey³

et al. 2017

Proceedings of 38th International Conference on High Energy Physics — PoS(ICHEP2016)

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The construction of low mass vertex detectors with a high level of system integration is of great interest for next generation collider experiments. Radiation length images with a sufficient spatial resolution can be used to measure and disentangle complex radiation length (X/X 0 ) profiles and contribute to the understanding of vertex detector systems. Beam test experiments with multi GeV particle beams and high resolution tracking telescopes provide an opportunity to obtain precise 2D images of the radiation length of thin planar objects. At the heart of the X/X 0 imaging is a spatially resolved measurement of the scattering angles of particles traversing the object under study. In order to demonstrate the capabilities of X/X 0 imaging, a beam test experiment has been conducted. The device under test was a mechanical prototype half-ladder of the Belle II pixel detector (PXD). The measured X/X 0 image was overlaid with a Geant4 simulation of a PXD half-ladder and excellent agreement was found. As shown here, radiation length imaging of detectors can serve as a method to validate geometry models of complex vertex detectors.

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“…Several runs at various beam energies and various magnetic field strengths have been recorded (distributed over 4 weeks) for offline analysis. In addition to the SVD and the PXD, 6 DATURA telescope planes [6] A picture of the four SVD ladders mounted on the supporting structure (Picture taken by Katsuro Nakamura (KEK)) is shown on the left-hand side. An event display for a typical test beam event to illustrate the arrangement of detectors is shown on the right-hand side.…”

Section: Methodsmentioning

confidence: 99%

Performance studies of the Belle II Silicon Vertex Detector with data taken at the DESY test beam in April 2016

Lück¹,

Adamczyk²,

Aihara³

et al. 2017

Proceedings of the 25th International Workshop on Vertex Detectors — PoS(Vertex 2016)

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Belle II is a multipurpose detector currently under construction and it will be operated at the next generation B-factory SuberKEKB in Japan. The main Belle II devices, devoted to the vertex reconstruction, are the Silicon Vertex Detector (SVD) and the Pixel Detector (PXD). In April 2016 a sector of the Belle II SVD and PXD has been tested in a beam of high energetic electrons at the test beam facility at DESY Hamburg (Germany). We report here the results for the hit efficiency estimation and the measurement of the resolution for the Belle II silicon vertex detector. Hit efficiencies are measured to be on average above 99.5% and the measured resolution is within the expectations.

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Performance of the EUDET-type beam telescopes

Cited by 166 publications

References 16 publications

CMS Pixel detector development for the HL-LHC

CMS Pixel detector development for the HL-LHC

Radiation length imaging with high resolution telescopes

Performance studies of the Belle II Silicon Vertex Detector with data taken at the DESY test beam in April 2016

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