1998
DOI: 10.1108/13565369810370319
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Performance of Cu‐ and Ag‐based microstrips up to millimetre wave frequencies

Abstract: Attenuation characteristics of microstrip transmission lines on alumina substrates up to 50GHz are discussed. The lines under test came from three different manufacturers, each of whom used different processes to realise the transmission lines. Two of the manufacturers used silver (Ag) paste, whereas the process of one of the manufacturers was copper (Cu) based. Each manufacturer used identical alumina substrates and identical test pattern files so that the measured attenuation properties reflected manufacture… Show more

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Cited by 7 publications
(4 citation statements)
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“…The presence of radiation was verified by electromagnetic simulator, HP Momentum. Typically, the measured values of the attenuation coefficient of the microstrip transmission lines have been obtained to be larger than the calculated ones [11].…”
Section: Resultsmentioning
confidence: 98%
See 1 more Smart Citation
“…The presence of radiation was verified by electromagnetic simulator, HP Momentum. Typically, the measured values of the attenuation coefficient of the microstrip transmission lines have been obtained to be larger than the calculated ones [11].…”
Section: Resultsmentioning
confidence: 98%
“…Microstrip lines made on 95% alumina substrates were manufactured using the direct copper bond method (AIT, England) with subsequent etching [11]. Thus, the conductivity of copper was expected to be very close to the bulk copper conductivity, σ Cu = 5.85 × 10 7 S m −1 [12].…”
Section: Test Circuits and Measuring Methodsmentioning
confidence: 99%
“…[ 138 ] Gravure is capable of printing high‐frequency transmission lines up to 40GHz using silver and copper inks. [ 286 ] It is possible to manufacture multilayer films with this technique in multiple gravure cylinders in a series configuration. Making a hybrid line with other roll‐to‐roll(R2R) configuration techniques, e.g., screen printing, is also possible.…”
Section: Printed Electronics Techniques Applications In Energy Harves...mentioning
confidence: 99%
“…Traditional thick film technology was unable to compete with thin film technology considering microwave specifications due to poor line resolution and high losses of thick films. Rapid development in novel thick-film material systems and advanced thick film circuit patterning techniques have changed this view and proved that thick film technology reaches beyond former limitations (Barnwell et al, 1998;Barnwell and O'Neil, 1997;Kemppinen et al, 1997).…”
Section: Introductionmentioning
confidence: 99%